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List of Intel CPU microarchitectures

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The following is a partial list of Intel CPU microarchitectures. The list is not complete.

Microarchitecture Pipeline stages
P5 (Pentium) 5
P6 (Pentium Pro) 14
P6 (Pentium 3) 10
NetBurst (Willamette) 20
NetBurst (Northwood) 20
NetBurst (Prescott) 31
NetBurst (Cedar Mill) 31
Core 14
Bonnell 16
8086
First x86 processor; initially a temporary substitute for the iAPX 432 to compete with MotorolaZilog, and National Semiconductor and to top the successful Z80.
186
Included a DMA controller, interrupt controller, timers, and chip select logic.
286
First x86 processor with protected mode.
i386
First 32-bit x86 processor.
i486
Intel's second-generation of 32-bit x86 processors, included built in floating point unit and pipelining.
P5
Original Pentium microprocessors.
P6
Used in Pentium ProPentium IIPentium II XeonPentium III, and Pentium III Xeon microprocessors.
Pentium M
Updated version of Pentium III's P6 microarchitecture designed from the ground up for mobile computing.
Enhanced Pentium M
Updated, dual core version of the Pentium M microarchitecture used in Core microprocessors.
NetBurst
Used in Pentium 4Pentium D, and some Xeon microprocessors. Commonly referred to as P7 although its internal name was P68 (P7 was used for Itanium). Later revisions were the first to feature Intel'sx86-64 architecture.
Core
Rearchitected P6-based microarchitecture used in Core 2 and Xeon microprocessors, built on a 65 nm process.
Penryn
45 nm shrink of the Core microarchitecture with larger cache, higher FSB and clock speeds, and SSE4.1 instructions.
Nehalem
Released November 17, 2008, built on a 45 nm process and used in the Core i7Core i5Core i3 microprocessors. Incorporates the memory controller into the CPU die.
Westmere
32 nm shrink of the Nehalem microarchitecture with several new features.
Sandy Bridge
Released January 9, 2011, built on a 32 nm process and used in the Core i7Core i5Core i3 second generation microprocessors, and in Pentium B9XX and Celeron B8XX series. Formerly called Gesherbut renamed in 2007.[1]
Ivy Bridge
22 nm shrink of the Sandy Bridge microarchitecture released April 28, 2012.
Haswell
New 22 nm microarchitecture, released June 3, 2013.
Broadwell
14 nm shrink of the Haswell microarchitecture, expected around 2014. Formerly called Rockwell.
Skylake
Future Intel microarchitecture, based on a 14 nm process.
Cannonlake
10 nm shrink of the Skylake microarchitecture.
Larrabee
Multi-core in-order x86-64 updated version of P5 microarchitecture, with wide SIMD vector units and texture sampling hardware for use in graphics. Cores derived from this microarchitecture are called MIC(Many Integrated Core).
Bonnell
45 nm, low-power, in-order microarchitecture for use in Atom processors.
Saltwell
32 nm shrink of the Bonnell microarchitecture.
Silvermont
22 nm, out-of-order microarchitecture for use in Atom processors.
Airmont
14 nm shrink of the Silvermont microarchitecture.
Goldmont
14 nm Atom microarchitecture.[2][3]

Itanium microarchitectures[edit]

Merced microarchitecture
Original Itanium microarchitecture. Used only in the first Itanium microprocessors.
McKinley microarchitecture
Enhanced microarchitecture used in the first two generations of the Itanium 2 microprocessor.
Montecito microarchitecture
Enhanced McKinley microarchitecture used in the Itanium 2 9000- and 9100-series of processors. Added dual core, coarse multithreading, and other improvements.
Tukwila microarchitecture
Enhanced microarchitecture used in the Itanium 9300 series of processors. Added quad core, SMT, an integrated memory controller, QuickPath Interconnect, and other improvements.
Poulson microarchitecture
Itanium processor featuring a new microarchitecture.[4]
Kittson microarchitecture
Future Itanium processors.

See also[edit]

References[edit]

External links[edit]

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http://en.wikipedia.org/wiki/Intel_cpus

List of Intel microprocessors

From Wikipedia, the free encyclopedia
  (Redirected from Intel cpus)
 

This generational and chronological list of Intel processors attempts to present all of Intel's processors from the pioneering 4-bit 4004 (1971) to the present high-end offerings, which include the 64-bit Itanium 2 (2002), Intel Core 2, and Xeon 5100 and 7100 series processors (2006). Concise technical data are given for each product.

Contents

[hide

The 4-bit processors[edit]

Intel 4004[edit]

First single-chip microprocessor

MCS-4 Family:

  • 4004 – CPU
  • 4001 – ROM & 4-bit Port
  • 4002 – RAM & 4-bit Port
  • 4003 – 10-bit Shift Register
  • 4008 – Memory+I/O Interface
  • 4009 – Memory+I/O Interface

Intel 4040[edit]

MCS-40 Family:

  • 4040 – CPU
  • 4101 – 1024-bit (256 × 4) Static RAM with separate I/O
  • 4201 – 4 MHz Clock Generator
  • 4207 – General Purpose Byte I/O Port
  • 4209 – General Purpose Byte I/O Port
  • 4211 – General Purpose Byte I/O Port
  • 4265 – Programmable General Purpose I/O Device
  • 4269 – Programmable Keyboard Display Device
  • 4289 – Standard Memory Interface for MCS-4/40
  • 4308 – 8192-bit (1024 × 8) ROM w/ 4-bit I/O Ports
  • 4316 – 16384-bit (2048 × 8) Static ROM
  • 4702 – 2048-bit (256 × 8) EPROM
  • 4801 – 5.185 MHz Clock Generator Crystal for 4004/4201A or 4040/4201A

The 8-bit processors[edit]

8008[edit]

  • Introduced April 1, 1972
  • Clock rate 500 kHz (8008–1: 800 kHz)
  • 0.05 MIPS
  • Bus width 8 bits (multiplexed address/data due to limited pins)
  • Enhancement load PMOS logic
  • Number of transistors 3,500 at 10 µm
  • Addressable memory 16 KB
  • Typical in early 8-bit microcomputers, dumb terminals, general calculators, bottling machines
  • Developed in tandem with 4004
  • Originally intended for use in the Datapoint 2200 microcomputer
  • Key volume deployment in Texas Instruments 742 microcomputer in >3,000 Ford dealerships

8080[edit]

  • Introduced April 1, 1974
  • Clock rate 2 MHz (very rare 8080B: 3 MHz)
  • 0.29 MIPS[2]
  • Bus width 8 bits data, 16 bits address
  • Enhancement load NMOS logic
  • Number of transistors 4,500, 6μm
  • Assembly language downwards compatible with 8008.
  • Addressable memory 64 KB
  • Up to 10X the performance of the 8008
  • Used in the Altair 8800Traffic light controllercruise missile
  • Required six support chips versus 20 for the 8008

8085[edit]

  • Introduced March 1976
  • Clock rate 3 MHz [3]
  • 0.37 MIPS
  • Bus width 8 bits data, 16 bits address
  • Depletion load NMOS logic
  • Number of transistors 6,500 at 3 µm
  • Binary compatible downwards with the 8080.
  • Used in Toledo scales. Also was used as a computer peripheral controller – modems, hard disks, printers, etc.
  • CMOS 80C85 in Mars SojournerRadio Shack Model 100 portable.
  • High level of integration, operating for the first time on a single 5-volt power supply, from 12 volts previously. Also featured serial I/O, 3 maskable interrupts, 1 non-maskable interrupt, 1 externally expandable interrupt w/[8259], status, DMA.
  • MCS-85 family contains processors and peripherals

Microcontrollers[edit]

They are ICs with CPU, RAM, ROM (or PROM or EPROM), I/O Ports, Timers & Interrupts

Intel 8048[edit]

MCS-48 family:

  • 8020 – Single-Component 8-bit Microcontroller
  • 8021 – Single-Component 8-bit Microcontroller
  • 8022 – Single-Component 8-bit Microcontroller With On-Chip A/D Converter
  • 8035 – Single-Component 8-bit Microcontroller
  • 8039 – Single-Component 8-bit Microcontroller
  • 8040 – Single-Component 8-bit Microcontroller
  • 8041 – Universal Peripheral Interface 8-bit Slave Microcontroller
  • 8641 – Universal Peripheral Interface 8-bit Slave Microcontroller
  • 8741 – Universal Peripheral Interface 8-bit Slave Microcontroller
  • 8042 – Universal Peripheral Interface 8-bit Slave Microcontroller
  • 8742 – Universal Peripheral Interface 8-bit Slave Microcontroller
  • 8243 – Input/Output Expander
  • 8048 – Single-Component 8-bit Microcontroller
  • 8048 – Single-Component 8-bit Microcontroller
  • 8748 – Single-Component 8-bit Microcontroller
  • 8048 – Single-Component 8-bit Microcontroller
  • 8049 – Single-Component 8-bit Microcontroller
  • 8749 – Single-Component 8-bit Microcontroller
  • 8050 – Single-Component 8-bit Microcontroller

Intel 8051[edit]

MCS-51 Family:

  • 8031 – 8-bit Control-Oriented Microcontroller
  • 8032 – 8-bit Control-Oriented Microcontroller
  • 8044 – High Performance 8-bit Microcontroller
  • 8344 – High Performance 8-bit Microcontroller
  • 8744 – High Performance 8-bit Microcontroller
  • 8051 – 8-bit Control-Oriented Microcontroller
  • 8052 – 8-bit Control-Oriented Microcontroller
  • 8054 – 8-bit Control-Oriented Microcontroller
  • 8058 – 8-bit Control-Oriented Microcontroller
  • 8351 – 8-bit Control-Oriented Microcontroller
  • 8352 – 8-bit Control-Oriented Microcontroller
  • 8354 – 8-bit Control-Oriented Microcontroller
  • 8358 – 8-bit Control-Oriented Microcontroller
  • 8751 – 8-bit Control-Oriented Microcontroller
  • 8752 – 8-bit Control-Oriented Microcontroller
  • 8754 – 8-bit Control-Oriented Microcontroller
  • 8758 – 8-bit Control-Oriented Microcontroller

Intel 80151[edit]

MCS-151 Family:

  • 80151 – High Performance 8-bit Control-Oriented Microcontroller
  • 83151 – High Performance 8-bit Control-Oriented Microcontroller
  • 87151 – High Performance 8-bit Control-Oriented Microcontroller
  • 80152 – High Performance 8-bit Control-Oriented Microcontroller
  • 83152 – High Performance 8-bit Control-Oriented Microcontroller

Intel 80251[edit]

MCS-251 Family:

  • 80251 – 8/16/32-bit Microcontroller
  • 80252 – 8/16/32-bit Microcontroller
  • 80452 – 8/16/32-bit Microcontroller
  • 83251 – 8/16/32-bit Microcontroller
  • 87251 – 8/16/32-bit Microcontroller
  • 87253 – 8/16/32-bit Microcontroller

MCS-96 Family[edit]

  • 8094 – 16-bit Microcontroller (48-Pin ROMLess Without A/D)
  • 8095 – 16-bit Microcontroller (48-Pin ROMLess With A/D)
  • 8096 – 16-bit Microcontroller (68-Pin ROMLess Without A/D)
  • 8097 – 16-bit Microcontroller (68-Pin ROMLess With A/D)
  • 8394 – 16-bit Microcontroller (48-Pin With ROM Without A/D)
  • 8395 – 16-bit Microcontroller (48-Pin With ROM With A/D)
  • 8396 – 16-bit Microcontroller (68-Pin With ROM Without A/D)
  • 8397 – 16-bit Microcontroller (68-Pin With ROM With A/D)
  • 8794 – 16-bit Microcontroller (48-Pin With EROM Without A/D)
  • 8795 – 16-bit Microcontroller (48-Pin With EROM With A/D)
  • 8796 – 16-bit Microcontroller (68-Pin With EROM Without A/D)
  • 8797 – 16-bit Microcontroller (68-Pin With EROM With A/D)
  • 8098 – 16-bit Microcontroller
  • 8398 – 16-bit Microcontroller
  • 8798 – 16-bit Microcontroller
  • 80196 – 16-bit Microcontroller
  • 83196 – 16-bit Microcontroller
  • 87196 – 16-bit Microcontroller
  • 80296 – 16-bit Microcontroller

The bit-slice processor[edit]

3000 Family[edit]

Intel D3002

Introduced in the third quarter of 1974, these components used bipolar Schottky transistors. Each component implemented two bits of a processor function; packages could be interconnected to build a processor with any desired word length. Members of the family:

  • 3001 – Microcontrol Unit
  • 3002 – 2-bit Arithmetic Logic Unit slice
  • 3003 – Look-ahead Carry Generator
  • 3205 – High-performance 1 Of 8 Binary Decoder
  • 3207 – Quad Bipolar-to-MOS Level Shifter and Driver
  • 3208 – Hex Sense Amp and Latch for MOS Memories
  • 3210 – TTL-to-MOS Level Shifter and High Voltage Clock Driver
  • 3211 – ECL-to-MOS Level Shifter and High Voltage Clock Driver
  • 3212 – Multimode Latch Buffer
  • 3214 – Interrupt Control Unit
  • 3216 – Parallel,Inverting Bi-Directional Bus Driver
  • 3222 – Refresh Controller for 4K NMOS DRAMs
  • 3226 – Parallel, Inverting Bi-Directional Bus Driver
  • 3232 – Address Multiplexer and Refresh Counter for 4K DRAMs
  • 3242 – Address Multiplexer and Refresh Counter for 16K DRAMs
  • 3245 – Quad Bipolar TTL-to-MOS Level Shifter and Driver for 4K
  • 3246 – Quad Bipolar ECL-to-MOS Level Shifter and Driver for 4K
  • 3404 – High-performance 6-bit Latch
  • 3408 – Hex Sense Amp and Latch for MOS Memories
  • 3505 - Next generation processor

Bus width 2*n bits data/address (depending on number n of slices used)

The 16-bit processors: MCS-86 family[edit]

8086[edit]

  • Introduced June 8, 1978
  • Clock rates:
    • 5 MHz with 0.33 MIPS[3]
    • 8 MHz with 0.66 MIPS
    • 10 MHz with 0.75 MIPS
  • The memory is divided into odd and even banks; it accesses both banks concurrently to read 16 bits of data in one clock cycle
  • Bus width 16 bits data, 20 bits address
  • Number of transistors 29,000 at 3 µm
  • Addressable memory 1 megabyte
  • Up to 10X the performance of 8080
  • Used in portable computing, and in the IBM PS/2 Model 25 and Model 30. Also used in the AT&T PC6300 / Olivetti M24, a popular IBM PC-compatible (predating the IBM PS/2 line).
  • Used segment registers to access more than 64 KB of data at once, which many programmers complained made their work excessively difficult.[citation needed]
  • The first x86 CPU.
  • Later renamed the iAPX 86[4]

8088[edit]

  • Introduced June 1, 1979
  • Clock rates:
    • 5 MHz with 0.33 MIPS
    • 8 MHz with 0.66 MIPS [3]
  • Internal architecture 16 bits
  • External bus Width 8 bits data, 20 bits address
  • Number of transistors 29,000 at 3 µm
  • Addressable memory 1 megabyte
  • Identical to 8086 except for its 8-bit external bus (hence an 8 instead of a 6 at the end); identical Execution Unit (EU), different Bus Interface Unit (BIU)[4]
  • Used in IBM PCs and PC clones
  • Later renamed the iAPX 88[4]

80186[edit]

  • Introduced 1982
  • Clock rates
    • 6 MHz with > 1 MIPS
  • Number of transistors 29,000 at 2 µm
  • Included two timers, a DMA controller, and an interrupt controller on the chip in addition to the processor (these were at fixed addresses which differed from the IBM PC, making it impossible to build a 100% PC-compatible computer around the 80186).
  • Added a few opcodes and exceptions to the 8086 design; otherwise identical instruction set to 8086 and 8088.
  • Used mostly in embedded applications – controllers, point-of-sale systems, terminals, and the like
  • Used in several non-PC-Compatible MS-DOS computers including RM Nimbus, Tandy 2000, and CP/M 86 Televideo PM16 server
  • Later renamed the iAPX 186

80188[edit]

  • A version of the 80186 with an 8-bit external data bus
  • Later renamed the iAPX 188

80286[edit]

  • Introduced February 1, 1982
  • Clock rates:
    • 6 MHz with 0.9 MIPS
    • 8 MHz, 10 MHz with 1.5 MIPS
    • 12.5 MHz with 2.66 MIPS
    • 16 MHz, 20 MHz and 25 MHz available.
  • Bus width: 16 bits data, 24 bits address.
  • Included memory protection hardware to support multitasking operating systems with per-process address space
  • Number of transistors 134,000 at 1.5 µm
  • Addressable memory 16 MB
  • Added protected-mode features to 8086 with essentially the same instruction set
  • 3–6X the performance of the 8086
  • Widely used in IBM-PC AT and AT clones contemporary to it

32-bit processors: the non-x86 microprocessors[edit]

iAPX 432[edit]

  • Introduced January 1, 1981 as Intel's first 32-bit microprocessor
  • Multi-chip CPU; Intel's first 32-bit microprocessor
  • Object/capability architecture
  • Microcoded operating system primitives
  • One terabyte virtual address space
  • Hardware support for fault tolerance
  • Two-chip General Data Processor (GDP), consists of 43201 and 43202
  • 43203 Interface Processor (IP) interfaces to I/O subsystem
  • 43204 Bus Interface Unit (BIU) simplifies building multiprocessor systems
  • 43205 Memory Control Unit (MCU)
  • Architecture and execution unit internal data base paths 32 bit
  • Clock rates:
    • 5 MHz
    • 7 MHz
    • 8 MHz

i960 aka 80960[edit]

  • Introduced April 5, 1988
  • RISC-like 32-bit architecture
  • Predominantly used in embedded systems
  • Evolved from the capability processor developed for the BiiN joint venture with Siemens
  • Many variants identified by two-letter suffixes.

i860 aka 80860[edit]

XScale[edit]

  • Introduced August 23, 2000
  • 32-bit RISC microprocessor based on the ARM architecture
  • Many variants, such as the PXA2xx applications processors, IOP3xx I/O processors and IXP2xxx and IXP4xx network processors.

32-bit processors: the 80386 range[edit]

80386DX[edit]

  • Introduced October 17, 1985
  • Clock rates:
    • 16 MHz with 5 MIPS
    • 20 MHz with 6 to 7 MIPS, introduced February 16, 1987
    • 25 MHz with 7.5 MIPS, introduced April 4, 1988
    • 33 MHz with 9.9 MIPS (9.4 SPECint92 on Compaq/i 16K L2), introduced April 10, 1989
  • Bus width 32 bits data, 32 bits address
  • Number of transistors 275,000 at 1 µm
  • Addressable memory 4 GB
  • Virtual memory 64 TB
  • First x86 chip to handle 32-bit data sets
  • Reworked and expanded memory protection support including paged virtual memory and virtual-86 mode, features required at the time by Xenix and Unix. This memory capability spurred the development and availability of OS/2 and is a fundamental requirement for modern operating systems like LinuxWindows, and OS X.
  • Used in desktop computing
  • Later renamed Intel386TM DX

80386SX[edit]

  • Introduced June 16, 1988
  • Clock rates:
    • 16 MHz with 2.5 MIPS
    • 20 MHz with 3.1 MIPS, introduced January 25, 1989
    • 25 MHz with 3.9 MIPS, introduced January 25, 1989
    • 33 MHz with 5.1 MIPS, introduced October 26, 1992
  • Internal architecture 32 bits
  • External data bus width 16 bits
  • External address bus width 24 bits
  • Number of transistors 275,000 at 1 µm
  • Addressable memory 16 MB
  • Virtual memory 32 GB
  • Narrower buses enable low-cost 32-bit processing
  • Used in entry-level desktop and portable computing
  • No Math Co-Processor
  • No commercial Software used for protected mode or virtual storage for many years
  • Later renamed Intel386TM SX

80376[edit]

The Intel i376 is an embedded version of the i386SX.

  • Introduced January 16, 1989; discontinued June 15, 2001
  • Variant of 386SX intended for embedded systems
  • No "real mode", starts up directly in "protected mode"
  • Replaced by much more successful 80386EX from 1994

80386SL[edit]

  • Introduced October 15, 1990
  • Clock rates:
    • 20 MHz with 4.21 MIPS
    • 25 MHz with 5.3 MIPS, introduced September 30, 1991
  • Internal architecture 32 bits
  • External bus width 16 bits
  • Number of transistors 855,000 at 1 µm
  • Addressable memory 4 GB
  • Virtual memory 1 TB
  • First chip specifically made for portable computers because of low power consumption of chip
  • Highly integrated, includes cache, bus, and memory controllers

80386EX[edit]

  • Introduced August 1994
  • Variant of 80386SX intended for embedded systems
  • Static core, i.e. may run as slowly (and thus, power efficiently) as desired, down to full halt
  • On-chip peripherals:
    • Clock and power management
    • Timers/counters
    • Watchdog timer
    • Serial I/O units (sync and async) and parallel I/O
    • DMA
    • RAM refresh
    • JTAG test logic
  • Significantly more successful than the 80376
  • Used aboard several orbiting satellites and microsatellites
  • Used in NASA's FlightLinux project

32-bit processors: the 80486 range[edit]

80486DX[edit]

  • Introduced April 10, 1989
  • Clock rates:
    • 25 MHz with 20 MIPS (16.8 SPECint92, 7.40 SPECfp92)
    • 33 MHz with 27 MIPS (22.4 SPECint92 on Micronics M4P 128 KB L2), introduced May 7, 1990
    • 50 MHz with 41 MIPS (33.4 SPECint92, 14.5 SPECfp92 on Compaq/50L 256 KB L2), introduced June 24, 1991
  • Bus width 32 bits
  • Number of transistors 1.2 million at 1 µm; the 50 MHz was at 0.8 µm
  • Addressable memory 4 GB
  • Virtual memory 1 TB
  • Level 1 cache of 8 KB on chip
  • Math coprocessor on chip
  • 50X performance of the 8088
  • Officially named Intel486TM DX
  • Used in Desktop computing and servers
  • Family 4 model 3

80486SX[edit]

  • Introduced April 22, 1991
  • Clock rates:
    • 16 MHz with 13 MIPS
    • 20 MHz with 16.5 MIPS, introduced September 16, 1991
    • 25 MHz with 20 MIPS (12 SPECint92), introduced September 16, 1991
    • 33 MHz with 27 MIPS (15.86 SPECint92), introduced September 21, 1992
  • Bus width 32 bits
  • Number of transistors 1.185 million at 1 µm and 900,000 at 0.8 µm
  • Addressable memory 4 GB
  • Virtual memory 1 TB
  • Identical in design to 486DX but without math coprocessor. The first version was an 80486DX with disabled math coprocessor in the chip and different pin configuration. If the user needed math coprocessor capabilities, he must add 487SX which was actually an 486DX with different pin configuration to prevent the user from installing a 486DX instead of 487SX, so with this configuration 486SX+487SX you had 2 identical CPU's with only 1 effectively turned on
  • Officially named Intel486TM SX
  • Used in low-cost entry to 486 CPU desktop computing, as well as extensively used in low cost mobile computing.
  • Upgradable with the Intel OverDrive processor
  • Family 4 model 2

80486DX2[edit]

  • Introduced March 3, 1992

Runs at twice the speed of the external bus (FSB). Fits on Socket 3

  • Clock rates:

    • 40 MHz
    • 50 MHz
    • 66 MHz
  • Officially named Intel486TM DX2

80486SL[edit]

  • Introduced November 9, 1992
  • Clock rates:
    • 20 MHz with 15.4 MIPS
    • 25 MHz with 19 MIPS
    • 33 MHz with 25 MIPS
  • Bus width 32 bits
  • Number of transistors 1.4 million at 0.8 µm
  • Addressable memory 4 GB
  • Virtual memory 1 TB
  • Officially named Intel486TM SL
  • Used in notebook computers
  • Family 4 model 3

80486DX4[edit]

  • Introduced March 7, 1994
  • Clock rates:
    • 75 MHz with 53 MIPS (41.3 SPECint92, 20.1 SPECfp92 on Micronics M4P 256 KB L2)
    • 100 MHz with 70.7 MIPS (54.59 SPECint92, 26.91 SPECfp92 on Micronics M4P 256 KB L2)
  • Number of transistors 1.6 million at 0.6 µm
  • Bus width 32 bits
  • Addressable memory 4 GB
  • Virtual memory 64 TB
  • Pin count 168 PGA Package, 208 sq ftP Package
  • Officially named Intel486TM DX4
  • Used in high performance entry-level desktops and value notebooks
  • Family 4 model 8

32-bit processors: P5 microarchitecture[edit]

Original Pentium[edit]

  • Bus width 64 bits
  • System bus clock rate 60 or 66 MHz
  • Address bus 32 bits
  • Addressable Memory 4 GB
  • Virtual Memory 64 TB
  • Superscalar architecture
  • Runs on 5 volts
  • Used in desktops
  • 8 KB of instruction cache
  • 8 KB of data cache
  • P5 – 0.8 µm process technology
    • Introduced March 22, 1993
    • Number of transistors 3.1 million
    • Socket 4 273 pin PGA processor package
    • Package dimensions 2.16" × 2.16"
    • Family 5 model 1
    • Variants
      • 60 MHz with 100 MIPS (70.4 SPECint92, 55.1 SPECfp92 on Xpress 256 KB L2)
      • 66 MHz with 112 MIPS (77.9 SPECint92, 63.6 SPECfp92 on Xpress 256 KB L2)
  • P54 – 0.6 µm process technology
    • Socket 5 296/320 pin PGA package
    • Number of transistors 3.2 million
    • Variants
      • 75 MHz with 126.5 MIPS (2.31 SPECint95, 2.02 SPECfp95 on Gateway P5 256K L2)

        • Introduced October 10, 1994
      • 90, 100 MHz with 149.8 and 166.3 MIPS respectively (2.74 SPECint95, 2.39 SPECfp95 on Gateway P5 256K L2 and 3.30 SPECint95, 2.59 SPECfp95 on Xpress 1ML2 respectively)
        • Introduced March 7, 1994
  • P54CQS – 0.35 µm process technology
    • Socket 5 296/320 pin PGA package
    • Number of transistors 3.2 million
    • Variants
      • 120 MHz with 203 MIPS (3.72 SPECint95, 2.81 SPECfp95 on Xpress 1MB L2)

        • Introduced March 27, 1995
  • P54CS – 0.35 µm process technology
    • Number of transistors 3.3 million
    • 90 mm² die size
    • Family 5 model 2
    • Variants
    • Socket 5 296/320 pin PGA package
      • 133 MHz with 218.9 MIPS (4.14 SPECint95, 3.12 SPECfp95 on Xpress 1MB L2)

        • Introduced June 12, 1995
      • 150, 166 MHz with 230 and 247 MIPS respectively
        • Introduced January 4, 1996
    • Socket 7 296/321 pin PGA package
      • 200 MHz with 270 MIPS (5.47 SPECint95, 3.68 SPECfp95)

        • Introduced June 10, 1996

Pentium with MMX Technology[edit]

  • P55C – 0.35 µm process technology

    • Introduced January 8, 1997
    • Intel MMX (instruction set) support
    • Socket 7 296/321 pin PGA (pin grid array) package
    • 16 KB L1 instruction cache
    • 16 KB L1 data cache
    • Number of transistors 4.5 million
    • System bus clock rate 66 MHz
    • Basic P55C is family 5 model 4, mobile are family 5 model 7 and 8
    • Variants
      • 166, 200 MHz Introduced January 8, 1997
      • 233 MHz Introduced June 2, 1997
      • 133 MHz (Mobile)
      • 166, 266 MHz (Mobile) Introduced January 12, 1998
      • 200, 233 MHz (Mobile) Introduced September 8, 1997
      • 300 MHz (Mobile) Introduced January 7, 1999

32-bit processors: P6/Pentium M microarchitecture[edit]

Pentium Pro[edit]

  • Introduced November 1, 1995
  • Precursor to Pentium II and III
  • Primarily used in server systems
  • Socket 8 processor package (387 pins) (Dual SPGA)
  • Number of transistors 5.5 million
  • Family 6 model 1
  • 0.6 µm process technology
    • 16 KB L1 cache
    • 256 KB integrated L2 cache
    • 60 MHz system bus clock rate
    • Variants
      • 150 MHz
  • 0.35 µm process technology, or 0.35 µm CPU with 0.6 µm L2 cache
    • Number of transistors 5.5 million
    • 512 KB or 256 KB integrated L2 cache
    • 60 or 66 MHz system bus clock rate
    • Variants
      • 166 MHz (66 MHz bus clock rate, 512 KB 0.35 µm cache) Introduced November 1, 1995
      • 180 MHz (60 MHz bus clock rate, 256 KB 0.6 µm cache) Introduced November 1, 1995
      • 200 MHz (66 MHz bus clock rate, 256 KB 0.6 µm cache) Introduced November 1, 1995
      • 200 MHz (66 MHz bus clock rate, 512 KB 0.35 µm cache) Introduced November 1, 1995
      • 200 MHz (66 MHz bus clock rate, 1 MB 0.35 µm cache) Introduced August 18, 1997

Pentium II[edit]

  • Introduced May 7, 1997
  • Pentium Pro with MMX and improved 16-bit performance
  • 242-pin Slot 1 (SEC) processor package
  • Voltage identification pins
  • Number of transistors 7.5 million
  • 32 KB L1 cache
  • 512 KB ½ bandwidth external L2 cache
  • The only Pentium II that did not have the L2 cache at ½ bandwidth of the core was the Pentium II 450 PE.
  • Klamath – 0.35 µm process technology (233, 266, 300 MHz)
    • 66 MHz system bus clock rate
    • Family 6 model 3
    • Variants
      • 233, 266, 300 MHz Introduced May 7, 1997
  • Deschutes – 0.25 µm process technology (333, 350, 400, 450 MHz)
    • Introduced January 26, 1998
    • 66 MHz system bus clock rate (333 MHz variant), 100 MHz system bus clock rate for all models after
    • Family 6 model 5
    • Variants
      • 333 MHz Introduced January 26, 1998
      • 350, 400 MHz Introduced April 15, 1998
      • 450 MHz Introduced August 24, 1998
      • 233, 266 MHz (Mobile) Introduced April 2, 1998
      • 333 MHz Pentium II Overdrive processor for Socket 8 Introduced August 10, 1998; Engineering Sample Photo[dead link]
      • 300 MHz (Mobile) Introduced September 9, 1998
      • 333 MHz (Mobile)

Celeron (Pentium II-based)[edit]

  • Covington – 0.25 µm process technology

    • Introduced April 15, 1998
    • 242-pin Slot 1 SEPP (Single Edge Processor Package)
    • Number of transistors 7.5 million
    • 66 MHz system bus clock rate
    • Slot 1
    • 32 KB L1 cache
    • No L2 cache
    • Variants
      • 266 MHz Introduced April 15, 1998
      • 300 MHz Introduced June 9, 1998
  • Mendocino – 0.25 µm process technology
    • Introduced August 24, 1998
    • 242-pin Slot 1 SEPP (Single Edge Processor Package), Socket 370 PPGA package
    • Number of transistors 19 million
    • 66 MHz system bus clock rate
    • Slot 1, Socket 370
    • 32 KB L1 cache
    • 128 KB integrated cache
    • Family 6 model 6
    • Variants
      • 300, 333 MHz Introduced August 24, 1998
      • 366, 400 MHz Introduced January 4, 1999
      • 433 MHz Introduced March 22, 1999
      • 466 MHz
      • 500 MHz Introduced August 2, 1999
      • 533 MHz Introduced January 4, 2000
      • 266 MHz (Mobile)
      • 300 MHz (Mobile)
      • 333 MHz (Mobile) Introduced April 5, 1999
      • 366 MHz (Mobile)
      • 400 MHz (Mobile)
      • 433 MHz (Mobile)
      • 450 MHz (Mobile) Introduced February 14, 2000
      • 466 MHz (Mobile)
      • 500 MHz (Mobile) Introduced February 14, 2000

Pentium II Xeon (chronological entry)

Pentium III[edit]

  • Katmai – 0.25 µm process technology

    • Introduced February 26, 1999
    • Improved PII, i.e. P6-based core, now including Streaming SIMD Extensions (SSE)
    • Number of transistors 9.5 million
    • 512 KB ½ bandwidth L2 External cache
    • 242-pin Slot 1 SECC2 (Single Edge Contact cartridge 2) processor package
    • System Bus clock rate 100 MHz, 133 MHz (B-models)
    • Slot 1
    • Family 6 model 7
    • Variants
      • 450, 500 MHz Introduced February 26, 1999
      • 550 MHz Introduced May 17, 1999
      • 600 MHz Introduced August 2, 1999
      • 533, 600 MHz Introduced (133 MHz bus clock rate) September 27, 1999
  • Coppermine – 0.18 µm process technology
    • Introduced October 25, 1999
    • Number of transistors 28.1 million
    • 256 KB Advanced Transfer L2 Cache (Integrated)
    • 242-pin Slot-1 SECC2 (Single Edge Contact cartridge 2) processor package, 370-pin FC-PGA (Flip-chip pin grid array) package
    • System Bus clock rate 100 MHz (E-models), 133 MHz (EB models)
    • Slot 1, Socket 370
    • Family 6 model 8
    • Variants
      • 500 MHz (100 MHz bus clock rate)
      • 533 MHz
      • 550 MHz (100 MHz bus clock rate)
      • 600 MHz
      • 600 MHz (100 MHz bus clock rate)
      • 650 MHz (100 MHz bus clock rate) Introduced October 25, 1999
      • 667 MHz Introduced October 25, 1999
      • 700 MHz (100 MHz bus clock rate) Introduced October 25, 1999
      • 733 MHz Introduced October 25, 1999
      • 750, 800 MHz (100 MHz bus clock rate) Introduced December 20, 1999
      • 850 MHz (100 MHz bus clock rate) Introduced March 20, 2000
      • 866 MHz Introduced March 20, 2000
      • 933 MHz Introduced May 24, 2000
      • 1000 MHz Introduced March 8, 2000 (not widely available at time of release)
      • 1100 MHz
      • 1133 MHz (first version recalled, later re-released)
      • 400, 450, 500 MHz (Mobile) Introduced October 25, 1999
      • 600, 650 MHz (Mobile) Introduced January 18, 2000
      • 700 MHz (Mobile) Introduced April 24, 2000
      • 750 MHz (Mobile) Introduced June 19, 2000
      • 800, 850 MHz (Mobile) Introduced September 25, 2000
      • 900, 1000 MHz (Mobile) Introduced March 19, 2001
  • Tualatin – 0.13 µm process technology
    • Introduced July 2001
    • Number of transistors 28.1 million
    • 32 KB L1 cache
    • 256 KB or 512 KB Advanced Transfer L2 cache (integrated)
    • 370-pin FC-PGA2 (flip-chip pin grid array) package
    • 133 MHz system bus clock rate
    • Socket 370
    • Family 6 model 11
    • Variants
      • 1133 MHz (256 KB L2)
      • 1133 MHz (512 KB L2)
      • 1200 MHz
      • 1266 MHz (512 KB L2)
      • 1333 MHz
      • 1400 MHz (512 KB L2)

Pentium II and III Xeon[edit]

  • PII Xeon

    • Variants

      • 400 MHz Introduced June 29, 1998
      • 450 MHz (512 KB L2 Cache) Introduced October 6, 1998
      • 450 MHz (1 MB and 2 MB L2 Cache) Introduced January 5, 1999
  • PIII Xeon
    • Introduced October 25, 1999
    • Number of transistors: 9.5 million at 0.25 µm or 28 million at 0.18 µm
    • L2 cache is 256 KB, 1 MB, or 2 MB Advanced Transfer Cache (Integrated)
    • Processor Package Style is Single Edge Contact Cartridge (S.E.C.C.2) or SC330
    • System Bus clock rate 133 MHz (256 KB L2 cache) or 100 MHz (1–2 MB L2 cache)
    • System Bus width 64 bits
    • Addressable memory 64 GB
    • Used in two-way servers and workstations (256 KB L2) or 4- and 8-way servers (1–2 MB L2)
    • Family 6 model 10
    • Variants
      • 500 MHz (0.25 µm process) Introduced March 17, 1999
      • 550 MHz (0.25 µm process) Introduced August 23, 1999
      • 600 MHz (0.18 µm process, 256 KB L2 cache) Introduced October 25, 1999
      • 667 MHz (0.18 µm process, 256 KB L2 cache) Introduced October 25, 1999
      • 733 MHz (0.18 µm process, 256 KB L2 cache) Introduced October 25, 1999
      • 800 MHz (0.18 µm process, 256 KB L2 cache) Introduced January 12, 2000
      • 866 MHz (0.18 µm process, 256 KB L2 cache) Introduced April 10, 2000
      • 933 MHz (0.18 µm process, 256 KB L2 cache)
      • 1000 MHz (0.18 µm process, 256 KB L2 cache) Introduced August 22, 2000
      • 700 MHz (0.18 µm process, 1–2 MB L2 cache) Introduced May 22, 2000

Celeron (Pentium III Coppermine-based)[edit]

  • Coppermine-128, 0.18 µm process technology

    • Introduced March, 2000
    • Streaming SIMD Extensions (SSE)
    • Socket 370FC-PGA processor package
    • Number of transistors: 28.1 million
    • 66 MHz system bus clock rate, 100 MHz system bus clock rate from January 3, 2001
    • 32 kB L1 cache
    • 128 kB Advanced Transfer L2 cache
    • Family 6 model 8
    • Variants
      • 533 MHz
      • 566 MHz
      • 600 MHz
      • 633, 667, 700 MHz Introduced June 26, 2000
      • 733, 766 MHz Introduced November 13, 2000
      • 800 MHz Introduced January 3, 2001
      • 850 MHz Introduced April 9, 2001
      • 900 MHz Introduced July 2, 2001
      • 950, 1000, 1100 MHz Introduced August 31, 2001
      • 550 MHz (Mobile)
      • 600, 650 MHz (Mobile) Introduced June 19, 2000
      • 700 MHz (Mobile) Introduced September 25, 2000
      • 750 MHz (Mobile) Introduced March 19, 2001
      • 800 MHz (Mobile)
      • 850 MHz (Mobile) Introduced July 2, 2001
      • 600 MHz (LV Mobile)
      • 500 MHz (ULV Mobile) Introduced January 30, 2001
      • 600 MHz (ULV Mobile)

XScale (chronological entry - non-x86 architechture)

Pentium 4 (not 4EE, 4E, 4F), Itanium, P4-based Xeon, Itanium 2 (chronological entries)

  • Introduced April 2000 – July 2002
  • See main entries

Celeron (Pentium III Tualatin-based)[edit]

  • Tualatin Celeron – 0.13 µm process technology

    • 32 KB L1 cache
    • 256 KB Advanced Transfer L2 cache
    • 100 MHz system bus clock rate
    • Socket 370
    • Family 6 model 11
    • Variants
      • 1.0 GHz
      • 1.1 GHz
      • 1.2 GHz
      • 1.3 GHz
      • 1.4 GHz

Pentium M[edit]

  • Banias 0.13 µm process technology

    • Introduced March 2003
    • 64 KB L1 cache
    • 1 MB L2 cache (integrated)
    • Based on Pentium III core, with SSE2 SIMD instructions and deeper pipeline
    • Number of transistors 77 million
    • Micro-FCPGAMicro-FCBGA processor package
    • Heart of the Intel mobile Centrino system
    • 400 MHz Netburst-style system bus
    • Family 6 model 9
    • Variants
      • 900 MHz (ultra low voltage)
      • 1.0 GHz (ultra low voltage)
      • 1.1 GHz (low voltage)
      • 1.2 GHz (low voltage)
      • 1.3 GHz
      • 1.4 GHz
      • 1.5 GHz
      • 1.6 GHz
      • 1.7 GHz
  • Dothan 0.09 µm (90 nm) process technology
    • Introduced May 2004
    • 2 MB L2 cache
    • 140 million transistors
    • Revised data prefetch unit
    • 400 MHz Netburst-style system bus
    • 21W TDP
    • Family 6 model 13
    • Variants
      • 1.00 GHz (Pentium M 723) (ultra low voltage, 5W TDP)
      • 1.10 GHz (Pentium M 733) (ultra low voltage, 5W TDP)
      • 1.20 GHz (Pentium M 753) (ultra low voltage, 5W TDP)
      • 1.30 GHz (Pentium M 718) (low voltage, 10W TDP)
      • 1.40 GHz (Pentium M 738) (low voltage, 10W TDP)
      • 1.50 GHz (Pentium M 758) (low voltage, 10W TDP)
      • 1.60 GHz (Pentium M 778) (low voltage, 10W TDP)
      • 1.40 GHz (Pentium M 710)
      • 1.50 GHz (Pentium M 715)
      • 1.60 GHz (Pentium M 725)
      • 1.70 GHz (Pentium M 735)
      • 1.80 GHz (Pentium M 745)
      • 2.00 GHz (Pentium M 755)
      • 2.10 GHz (Pentium M 765)
  • Dothan 533 0.09 µm (90 nm) process technology
    • Introduced Q1 2005
    • Same as Dothan except with a 533 MHz NetBurst-style system bus and 27W TDP
    • Variants
      • 1.60 GHz (Pentium M 730)
      • 1.73 GHz (Pentium M 740)
      • 1.86 GHz (Pentium M 750)
      • 2.00 GHz (Pentium M 760)
      • 2.13 GHz (Pentium M 770)
      • 2.26 GHz (Pentium M 780)
  • Stealey 0.09 µm (90 nm) process technology
    • Introduced Q2 2007
    • 512 KB L2, 3W TDP
    • Variants
      • 600 MHz (A100)
      • 800 MHz (A110)

Celeron M[edit]

  • Banias-512 0.13 µm process technology

    • Introduced March 2003
    • 64 KB L1 cache
    • 512 KB L2 cache (integrated)
    • SSE2 SIMD instructions
    • No SpeedStep technology, is not part of the 'Centrino' package
    • Family 6 model 9
    • Variants
      • 310 – 1.20 GHz
      • 320 – 1.30 GHz
      • 330 – 1.40 GHz
      • 340 – 1.50 GHz
  • Dothan-1024 90 nm process technology
    • 64 KB L1 cache
    • 1 MB L2 cache (integrated)
    • SSE2 SIMD instructions
    • No SpeedStep technology, is not part of the 'Centrino' package
    • Variants
      • 350 – 1.30 GHz
      • 350J – 1.30 GHz, with Execute Disable bit
      • 360 – 1.40 GHz
      • 360J – 1.40 GHz, with Execute Disable bit
      • 370 – 1.50 GHz, with Execute Disable bit
        • Family 6, Model 13, Stepping 8[5]
      • 380 – 1.60 GHz, with Execute Disable bit
      • 390 – 1.70 GHz, with Execute Disable bit
  • Yonah-1024 65 nm process technology
    • 64 KB L1 cache
    • 1 MB L2 cache (integrated)
    • SSE3 SIMD instructions, 533 MHz front-side bus, execute-disable bit
    • No SpeedStep technology, is not part of the 'Centrino' package
    • Variants
      • 410 – 1.46 GHz
      • 420 – 1.60 GHz,
      • 423 – 1.06 GHz (ultra low voltage)
      • 430 – 1.73 GHz
      • 440 – 1.86 GHz
      • 443 – 1.20 GHz (ultra low voltage)
      • 450 – 2.00 GHz

Intel Core[edit]

  • Yonah 0.065 µm (65 nm) process technology

    • Introduced January 2006
    • 533/667 MHz front side bus
    • 2 MB (Shared on Duo) L2 cache
    • SSE3 SIMD instructions
    • 31W TDP (T versions)
    • Family 6, Model 14
    • Variants:
      • Intel Core Duo T2700 2.33 GHz
      • Intel Core Duo T2600 2.16 GHz
      • Intel Core Duo T2500 2 GHz
      • Intel Core Duo T2450 2 GHz
      • Intel Core Duo T2400 1.83 GHz
      • Intel Core Duo T2300 1.66 GHz
      • Intel Core Duo T2050 1.6 GHz
      • Intel Core Duo T2300e 1.66 GHz
      • Intel Core Duo T2080 1.73 GHz
      • Intel Core Duo L2500 1.83 GHz (low voltage, 15W TDP)
      • Intel Core Duo L2400 1.66 GHz (low voltage, 15W TDP)
      • Intel Core Duo L2300 1.5 GHz (low voltage, 15W TDP)
      • Intel Core Duo U2500 1.2 GHz (ultra low voltage, 9W TDP)
      • Intel Core Solo T1350 1.86 GHz (533 FSB)
      • Intel Core Solo T1300 1.66 GHz
      • Intel Core Solo T1200 1.5 GHz [6]

Dual-Core Xeon LV[edit]

  • Sossaman 0.065 µm (65 nm) process technology

    • Introduced March 2006
    • Based on Yonah core, with SSE3 SIMD instructions
    • 667 MHz frontside bus
    • 2 MB Shared L2 cache
    • Variants
      • 2.0 GHz

32-bit processors: NetBurst microarchitecture[edit]

Pentium 4[edit]

  • 0.18 µm process technology (1.40 and 1.50 GHz)

    • Introduced November 20, 2000
    • L2 cache was 256 KB Advanced Transfer Cache (Integrated)
    • Processor Package Style was PGA423, PGA478
    • System Bus clock rate 400 MHz
    • SSE2 SIMD Extensions
    • Number of transistors 42 million
    • Used in desktops and entry-level workstations
  • 0.18 µm process technology (1.7 GHz)
    • Introduced April 23, 2001
    • See the 1.4 and 1.5 chips for details
  • 0.18 µm process technology (1.6 and 1.8 GHz)
    • Introduced July 2, 2001
    • See 1.4 and 1.5 chips for details
    • Core Voltage is 1.15 volts in Maximum Performance Mode; 1.05 volts in Battery Optimized Mode
    • Power <1 watt in Battery Optimized Mode
    • Used in full-size and then light mobile PCs
  • 0.18 µm process technology Willamette (1.9 and 2.0 GHz)
    • Introduced August 27, 2001
    • See 1.4 and 1.5 chips for details
  • Family 15 model 1
  • Pentium 4 (2 GHz, 2.20 GHz)
    • Introduced January 7, 2002
  • Pentium 4 (2.4 GHz)
    • Introduced April 2, 2002
  • 0.13 µm process technology Northwood A (1.7, 1.8, 1.9, 2, 2.2, 2.4, 2.5, 2.6, 2.8(OEM),3.0(OEM) GHz)
    • Improved branch prediction and other microcodes tweaks
    • 512 KB integrated L2 cache
    • Number of transistors 55 million
    • 400 MHz system bus.
  • Family 15 model 2
  • 0.13 µm process technology Northwood B (2.26, 2.4, 2.53, 2.66, 2.8, 3.06 GHz)
  • 0.13 µm process technology Northwood C (2.4, 2.6, 2.8, 3.0, 3.2, 3.4 GHz)
    • 800 MHz system bus (all versions include Hyper-Threading)
    • 6500 to 10000 MIPS

Itanium (chronological entry - new non-x86 architechture)

Xeon[edit]

  • Official designation now Xeon, i.e. not "Pentium 4 Xeon"
  • Xeon 1.4, 1.5, 1.7 GHz
    • Introduced May 21, 2001
    • L2 cache was 256 KB Advanced Transfer Cache (Integrated)
    • Processor Package Style was Organic Land Grid Array 603 (OLGA 603)
    • System Bus clock rate 400 MHz
    • SSE2 SIMD Extensions
    • Used in high-performance and mid-range dual processor enabled workstations
  • Xeon 2.0 GHz and up to 3.6 GHz
    • Introduced September 25, 2001

Itanium 2 (chronological entry - new non-x86 architechture)

Mobile Pentium 4-M[edit]

  • 0.13 µm process technology
  • 55 million transistors
  • cache L2 512 KB
  • BUS a 400 MHz
  • Supports up to 1 GB of DDR 266 MHz Memory
  • Supports ACPI 2.0 and APM 1.2 System Power Management
  • 1.3 V – 1.2 V (SpeedStep)
  • Power: 1.2 GHz 20.8 W, 1.6 GHz 30 W, 2.6 GHz 35 W
  • Sleep Power 5 W (1.2 V)
  • Deeper Sleep Power = 2.9 W (1.0 V)
    • 1.40 GHz – 23 April 2002
    • 1.50 GHz – 23 April 2002
    • 1.60 GHz – 4 March 2002
    • 1.70 GHz – 4 March 2002
    • 1.80 GHz – 23 April 2002
    • 1.90 GHz – 24 June 2002
    • 2.00 GHz – 24 June 2002
    • 2.20 GHz – 16 September 2002
    • 2.40 GHz – 14 January 2003
    • 2.50 GHz – 16 April 2003
    • 2.60 GHz – 11 June 2003

Pentium 4 EE[edit]

  • Introduced September 2003
  • EE = "Extreme Edition"
  • Built from the Xeon's "Gallatin" core, but with 2 MB cache

Pentium 4E[edit]

  • Introduced February 2004
  • built on 0.09 µm (90 nm) process technology Prescott (2.4A, 2.8, 2.8A, 3.0, 3.2, 3.4, 3.6, 3.8) 1 MB L2 cache
  • 533 MHz system bus (2.4A and 2.8A only)
  • Number of transistors 125 million on 1 MB Models
  • Number of transistors 169 million on 2 MB Models
  • 800 MHz system bus (all other models)
  • Hyper-Threading support is only available on CPUs using the 800 MHz system bus.
  • The processor's integer instruction pipeline has been increased from 20 stages to 31 stages, which theoretically allows for even greater bandwidth.
  • 7500 to 11000 MIPS
  • LGA 775 versions are in the 5xx series (32-bit) and 5x1 series (with Intel 64)
  • The 6xx series has 2 MB L2 cache and Intel 64

Pentium 4F[edit]

  • Introduced Spring 2004
  • same core as 4E, "Prescott"
  • 3.2–3.6 GHz
  • starting with the D0 stepping of this processor, Intel 64 64-bit extensions has also been incorporated

64-bit processors: IA-64[edit]

Itanium[edit]

  • Code name Merced
  • Family 7
  • Released May 29, 2001
  • 733 MHz and 800 MHz
  • 2MB cache
  • All recalled and replaced by Itanium 2

Itanium 2[edit]

  • Family 0x1F
  • Released July 2002
  • 900 MHz – 1.6 GHz
  • McKinley 900 MHz 1.5 MB cache, Model 0x0
  • McKinley 1 GHz, 3 MB cache, Model 0x0
  • Deerfield 1 GHz, 1.5 MB cache, Model 0x1
  • Madison 1.3 GHz, 3 MB cache, Model 0x1
  • Madison 1.4 GHz, 4 MB cache, Model 0x1
  • Madison 1.5 GHz, 6 MB cache, Model 0x1
  • Madison 1.67 GHz, 9 MB cache, Model 0x1
  • Hondo 1.4 GHz, 4 MB cache, dual-core MCM, Model 0x1

64-bit processors: Intel 64 – NetBurst microarchitecture[edit]

  • Intel Extended Memory 64 Technology
  • Mostly compatible with AMD's AMD64 architecture
  • Introduced Spring 2004, with the Pentium 4F (D0 and later P4 steppings)

Pentium 4F[edit]

  • Prescott-2M built on 0.09 µm (90 nm) process technology
  • 2.8–3.8 GHz (model numbers 6x0)
  • Introduced February 20, 2005
  • Same features as Prescott with the addition of:
    • 2 MB cache
    • Intel 64-bit
    • Enhanced Intel SpeedStep Technology (EIST)
  • Cedar Mill built on 0.065 µm (65 nm) process technology
  • 3.0–3.6 (model numbers 6x1)
  • Introduced January 16, 2006
  • Die shrink of Prescott-2M
  • Same features as Prescott-2M
  • Family 15 Model 4

Pentium D[edit]

  • Smithfield – 90 nm process technology (2.66–3.2 GHz)

    • Introduced May 26, 2005
    • 2.66–3.2 GHz (model numbers 805–840)
    • Number of transistors 230 million
    • 1 MB × 2 (non-shared, 2 MB total) L2 cache
    • Cache coherency between cores requires communication over the FSB
    • Performance increase of 60% over similarly clocked Prescott
    • 2.66 GHz (533 MHz FSB) Pentium D 805 introduced December 2005
    • Contains 2x Prescott dies in one package
    • Family 15 Model 4
  • Presler – 65 nm process technology (2.8–3.6 GHz)

    • Introduced January 16, 2006
    • 2.8–3.6 GHz (model numbers 915–960)
    • Number of transistors 376 million
    • 2 MB × 2 (non-shared, 4 MB total) L2 cache
    • Contains 2x Cedar Mill dies in one package
    • Variants
      • Pentium D 945

Pentium Extreme Edition[edit]

  • Dual-core microprocessor
  • Enabled Hyper-Threading
  • 800(4×200) MHz front side bus
  • Smithfield – 90 nm process technology (3.2 GHz)

    • Variants

      • Pentium 840 EE – 3.20 GHz (2 × 1 MB L2)
  • Presler – 65 nm process technology (3.46, 3.73)

    • 2 MB × 2 (non-shared, 4 MB total) L2 cache
    • Variants

Xeon[edit]

  • Nocona

    • Introduced 2004
  • Irwindale

    • Introduced 2004
  • Cranford

    • Introduced April 2005
    • MP version of Nocona
  • Potomac

    • Introduced April 2005
    • Cranford with 8 MB of L3 cache
  • Paxville DP (2.8 GHz)

    • Introduced October 10, 2005
    • Dual-core version of Irwindale, with 4 MB of L2 Cache (2 MB per core)
    • 2.8 GHz
    • 800 MT/s front side bus
  • Paxville MP – 90 nm process (2.67 – 3.0 GHz)

    • Introduced November 1, 2005
    • Dual-core Xeon 7000 series
    • MP-capable version of Paxville DP
    • 2 MB of L2 Cache (1 MB per core) or 4 MB of L2 (2 MB per core)
    • 667 MT/s FSB or 800 MT/s FSB
  • Dempsey – 65 nm process (2.67 – 3.73 GHz)

    • Introduced May 23, 2006
    • Dual-core Xeon 5000 series
    • MP version of Presler
    • 667 MT/s or 1066 MT/s FSB
    • 4 MB of L2 Cache (2 MB per core)
    • LGA 771 (Socket J).
  • Tulsa – 65 nm process (2.5 – 3.4 GHz)

    • Introduced August 29, 2006
    • Dual-core Xeon 7100-series
    • Improved version of Paxville MP
    • 667 MT/s or 800 MT/s FSB

64-bit processors: Intel 64 – Core microarchitecture[edit]

Xeon[edit]

  • Woodcrest – 65 nm process technology

    • Server and Workstation CPU (SMP support for dual CPU system)
    • Introduced June 26, 2006
    • Dual-core
    • Intel VT-x, multiple OS support
    • EIST (Enhanced Intel SpeedStep Technology) in 5140, 5148LV, 5150, 5160
    • Execute Disable Bit
    • TXT, enhanced security hardware extensions
    • SSSE3 SIMD instructions
    • iAMT2 (Intel Active Management Technology), remotely manage computers
    • Variants
      • Xeon 5160 – 3.00 GHz (4 MB L2, 1333 MHz FSB, 80 W)
      • Xeon 5150 – 2.66 GHz (4 MB L2, 1333 MHz FSB, 65 W)
      • Xeon 5140 – 2.33 GHz (4 MB L2, 1333 MHz FSB, 65 W)
      • Xeon 5130 – 2.00 GHz (4 MB L2, 1333 MHz FSB, 65 W)
      • Xeon 5120 – 1.86 GHz (4 MB L2, 1066 MHz FSB, 65 W)
      • Xeon 5110 – 1.60 GHz (4 MB L2, 1066 MHz FSB, 65 W)
      • Xeon 5148LV – 2.33 GHz (4 MB L2, 1333 MHz FSB, 40 W) (low voltage edition)
  • Clovertown – 65 nm process technology

    • Server and Workstation CPU (SMP support for dual CPU system)
    • Introduced December 13, 2006
    • Quad-core
    • Intel VT-x, multiple OS support
    • EIST (Enhanced Intel SpeedStep Technology) in E5365, L5335
    • Execute Disable Bit
    • TXT, enhanced security hardware extensions
    • SSSE3 SIMD instructions
    • iAMT2 (Intel Active Management Technology), remotely manage computers
    • Variants
      • Xeon X5355 – 2.66 GHz (2×4 MB L2, 1333 MHz FSB, 105 W)
      • Xeon E5345 – 2.33 GHz (2×4 MB L2, 1333 MHz FSB, 80 W)
      • Xeon E5335 – 2.00 GHz (2×4 MB L2, 1333 MHz FSB, 80 W)
      • Xeon E5320 – 1.86 GHz (2×4 MB L2, 1066 MHz FSB, 65 W)
      • Xeon E5310 – 1.60 GHz (2×4 MB L2, 1066 MHz FSB, 65 W)
      • Xeon L5320 – 1.86 GHz (2×4 MB L2, 1066 MHz FSB, 50 W) (low voltage edition)

Intel Core 2[edit]

  • Conroe – 65 nm process technology

    • Desktop CPU (SMP support restricted to 2 CPUs)
    • Two cores on one die
    • Introduced July 27, 2006
    • SSSE3 SIMD instructions
    • Number of transistors: 291 million
    • 64 KB of L1 cache per core (32+32 KB 8-way)
    • Intel VT-x, multiple OS support
    • TXT, enhanced security hardware extensions
    • Execute Disable Bit
    • EIST (Enhanced Intel SpeedStep Technology)
    • iAMT2 (Intel Active Management Technology), remotely manage computers
    • LGA 775
    • Variants
      • Core 2 Duo E6850 – 3.00 GHz (4 MB L2, 1333 MHz FSB)
      • Core 2 Duo X6800 – 2.93 GHz (4 MB L2, 1066 MHz FSB)
      • Core 2 Duo E6750 – 2.67 GHz (4 MB L2, 1333 MHz FSB, 65W)
      • Core 2 Duo E6700 – 2.67 GHz (4 MB L2, 1066 MHz FSB)
      • Core 2 Duo E6600 – 2.40 GHz (4 MB L2, 1066 MHz FSB, 65W)
      • Core 2 Duo E6550 – 2.33 GHz (4 MB L2, 1333 MHz FSB)
      • Core 2 Duo E6420 – 2.13 GHz (4 MB L2, 1066 MHz FSB)
      • Core 2 Duo E6400 – 2.13 GHz (2 MB L2, 1066 MHz FSB)
      • Core 2 Duo E6320 – 1.86 GHz (4 MB L2, 1066 MHz FSB) Family 6, Model 15, Stepping 6
      • Core 2 Duo E6300 – 1.86 GHz (2 MB L2, 1066 MHz FSB)
  • Conroe XE – 65 nm process technology

    • Desktop Extreme Edition CPU (SMP support restricted to 2 CPUs)
    • Introduced July 27, 2006
    • same features as Conroe
    • LGA 775
    • Variants
      • Core 2 Extreme X6800 – 2.93 GHz (4 MB L2, 1066 MHz FSB)
  • Allendale – 65 nm process technology

    • Desktop CPU (SMP support restricted to 2 CPUs)
    • Two CPUs on one die
    • Introduced January 21, 2007
    • SSSE3 SIMD instructions
    • Number of transistors 167 million
    • TXT, enhanced security hardware extensions
    • Execute Disable Bit
    • EIST (Enhanced Intel SpeedStep Technology)
    • iAMT2 (Intel Active Management Technology), remotely manage computers
    • LGA 775
    • Variants
      • Core 2 Duo E4700 – 2.60 GHz (2 MB L2, 800 MHz FSB)
      • Core 2 Duo E4600 – 2.40 GHz (2 MB L2, 800 MHz FSB)
      • Core 2 Duo E4500 – 2.20 GHz (2 MB L2, 800 MHz FSB)
      • Core 2 Duo E4400 – 2.00 GHz (2 MB L2, 800 MHz FSB)
      • Core 2 Duo E4300 – 1.80 GHz (2 MB L2, 800 MHz FSB) Family 6, Model 15, Stepping 2
  • Merom – 65 nm process technology

    • Mobile CPU (SMP support restricted to 2 CPUs)
    • Introduced July 27, 2006
    • Family 6, Model 15
    • same features as Conroe
    • Socket M / Socket P
    • Variants
      • Core 2 Duo T7800 – 2.60 GHz (4 MB L2, 800 MHz FSB) (Santa Rosa platform)
      • Core 2 Duo T7700 – 2.40 GHz (4 MB L2, 800 MHz FSB)
      • Core 2 Duo T7600 – 2.33 GHz (4 MB L2, 667 MHz FSB)
      • Core 2 Duo T7500 – 2.20 GHz (4 MB L2, 800 MHz FSB)
      • Core 2 Duo T7400 – 2.16 GHz (4 MB L2, 667 MHz FSB)
      • Core 2 Duo T7300 – 2.00 GHz (4 MB L2, 800 MHz FSB)
      • Core 2 Duo T7250 – 2.00 GHz (2 MB L2, 800 MHz FSB)
      • Core 2 Duo T7200 – 2.00 GHz (4 MB L2, 667 MHz FSB)
      • Core 2 Duo T7100 – 1.80 GHz (2 MB L2, 800 MHz FSB)
      • Core 2 Duo T5600 – 1.83 GHz (2 MB L2, 667 MHz FSB) Family 6, Model 15, Stepping 6
      • Core 2 Duo T5550 – 1.83 GHz (2 MB L2, 667 MHz FSB, no VT)
      • Core 2 Duo T5500 – 1.66 GHz (2 MB L2, 667 MHz FSB, no VT)
      • Core 2 Duo T5470 – 1.60 GHz (2 MB L2, 800 MHz FSB, no VT) Family 6, Model 15, Stepping 13
      • Core 2 Duo T5450 – 1.66 GHz (2 MB L2, 667 MHz FSB, no VT)
      • Core 2 Duo T5300 – 1.73 GHz (2 MB L2, 533 MHz FSB, no VT)
      • Core 2 Duo T5270 – 1.40 GHz (2 MB L2, 800 MHz FSB, no VT)
      • Core 2 Duo T5250 – 1.50 GHz (2 MB L2, 667 MHz FSB, no VT)
      • Core 2 Duo T5200 – 1.60 GHz (2 MB L2, 533 MHz FSB, no VT)
      • Core 2 Duo L7500 – 1.60 GHz (4 MB L2, 800 MHz FSB) (low voltage)
      • Core 2 Duo L7400 – 1.50 GHz (4 MB L2, 667 MHz FSB) (low voltage)
      • Core 2 Duo L7300 – 1.40 GHz (4 MB L2, 800 MHz FSB) (low voltage)
      • Core 2 Duo L7200 – 1.33 GHz (4 MB L2, 667 MHz FSB) (low voltage)
      • Core 2 Duo U7700 – 1.33 GHz (2 MB L2, 533 MHz FSB) (ultra low voltage)
      • Core 2 Duo U7600 – 1.20 GHz (2 MB L2, 533 MHz FSB) (ultra low voltage)
      • Core 2 Duo U7500 – 1.06 GHz (2 MB L2, 533 MHz FSB) (ultra low voltage)
  • Kentsfield – 65 nm process technology

    • Two dual-core CPU dies in one package.
    • Desktop CPU quad-core (SMP support restricted to 4 CPUs)
    • Introduced December 13, 2006
    • same features as Conroe but with 4 CPU cores
    • Number of transistors 586 million
    • LGA 775
    • Family 6, Model 15, Stepping 11
    • Variants
      • Core 2 Extreme QX6850 – 3 GHz (2×4 MB L2 Cache, 1333 MHz FSB)
      • Core 2 Extreme QX6800 – 2.93 GHz (2×4 MB L2 Cache, 1066 MHz FSB) (April 9, 2007)
      • Core 2 Extreme QX6700 – 2.66 GHz (2×4 MB L2 Cache, 1066 MHz FSB) (November 14, 2006)
      • Core 2 Quad Q6700 – 2.66 GHz (2×4 MB L2 Cache, 1066 MHz FSB) (July 22, 2007)
      • Core 2 Quad Q6600 – 2.40 GHz (2×4 MB L2 Cache, 1066 MHz FSB) (January 7, 2007)
  • Wolfdale – 45 nm process technology

    • Die shrink of Conroe
    • Same features as Conroe with the addition of:
      • 50% more cache, 6 MB as opposed to 4 MB
      • Intel Trusted Execution Technology
      • SSE4 SIMD instructions
    • Number of transistors 410 million
    • Variants
      • Core 2 Duo E8600 – 3.33 GHz (6 MB L2, 1333 MHz FSB)
      • Core 2 Duo E8500 – 3.16 GHz (6 MB L2, 1333 MHz FSB)
      • Core 2 Duo E8435 – 3.07 GHz (6 MB L2, 1066 MHz FSB)
      • Core 2 Duo E8400 – 3.00 GHz (6 MB L2, 1333 MHz FSB)
      • Core 2 Duo E8335 – 2.93 GHz (6 MB L2, 1066 MHz FSB)
      • Core 2 Duo E8300 – 2.83 GHz (6 MB L2, 1333 MHz FSB)
      • Core 2 Duo E8235 – 2.80 GHz (6 MB L2, 1066 MHz FSB)
      • Core 2 Duo E8200 – 2.66 GHz (6 MB L2, 1333 MHz FSB)
      • Core 2 Duo E8135 – 2.66 GHz (6 MB L2, 1066 MHz FSB)
      • Core 2 Duo E8190 – 2.66 GHz (6 MB L2, 1333 MHz FSB, no TXT, no VT)
  • Wolfdale-3M – 45 nm process technology

    • Intel Trusted Execution Technology
    • Variants
      • Core 2 Duo E7600 – 3.06 GHz (3 MB L2, 1066 MHz FSB)
      • Core 2 Duo E7500 – 2.93 GHz (3 MB L2, 1066 MHz FSB)
      • Core 2 Duo E7400 – 2.80 GHz (3 MB L2, 1066 MHz FSB)
      • Core 2 Duo E7300 – 2.66 GHz (3 MB L2, 1066 MHz FSB)
      • Core 2 Duo E7200 – 2.53 GHz (3 MB L2, 1066 MHz FSB)
  • Yorkfield – 45 nm process technology

    • Quad-core CPU
    • Die shrink of Kentsfield
    • Contains 2x Wolfdale dual-core dies in one package
    • Same features as Wolfdale
    • Number of transistors 820 million
    • Variants
      • Core 2 Extreme QX9770 – 3.20 GHz (2×6 MB L2, 1600 MHz FSB)
      • Core 2 Extreme QX9650 – 3.00 GHz (2×6 MB L2, 1333 MHz FSB)
      • Core 2 Quad Q9705 – 3.16 GHz (2×3 MB L2, 1333 MHz FSB)
      • Core 2 Quad Q9700 – 3.16 GHz (2×3 MB L2, 1333 MHz FSB)
      • Core 2 Quad Q9650 – 3 GHz (2×6 MB L2, 1333 MHz FSB)
      • Core 2 Quad Q9550 – 2.83 GHz (2×6 MB L2, 1333 MHz FSB, 95W TDP)
      • Core 2 Quad Q9550s – 2.83 GHz (2×6 MB L2, 1333 MHz FSB, 65W TDP)
      • Core 2 Quad Q9450 – 2.66 GHz (2×6 MB L2, 1333 MHz FSB, 95W TDP)
      • Core 2 Quad Q9505 – 2.83 GHz (2×3 MB L2, 1333 MHz FSB, 95W TDP)
      • Core 2 Quad Q9505s – 2.83 GHz (2×3 MB L2, 1333 MHz FSB, 65W TDP)
      • Core 2 Quad Q9500 – 2.83 GHz (2×3 MB L2, 1333 MHz FSB, 95W TDP, no TXT)
      • Core 2 Quad Q9400 – 2.66 GHz (2×3 MB L2, 1333 MHz FSB, 95W TDP)
      • Core 2 Quad Q9400s – 2.66 GHz (2×3 MB L2, 1333 MHz FSB, 65W TDP)
      • Core 2 Quad Q9300 – 2.50 GHz (2×3 MB L2, 1333 MHz FSB, 95W TDP)
      • Core 2 Quad Q8400 – 2.66 GHz (2×2 MB L2, 1333 MHz FSB, 95W TDP)
      • Core 2 Quad Q8400s – 2.66 GHz (2×2 MB L2, 1333 MHz FSB, 65W TDP)
      • Core 2 Quad Q8300 – 2.50 GHz (2×2 MB L2, 1333 MHz FSB, 95W TDP)
      • Core 2 Quad Q8300s – 2.50 GHz (2×2 MB L2, 1333 MHz FSB, 65W TDP)
      • Core 2 Quad Q8200 – 2.33 GHz (2×2 MB L2, 1333 MHz FSB, 95W TDP)
      • Core 2 Quad Q8200s – 2.33 GHz (2×2 MB L2, 1333 MHz FSB, 65W TDP)
      • Core 2 Quad Q7600 – 2.70 GHz (2×1 MB L2, 800 MHz FSB, no SSE4) (no Q7600 listed here)
  • Intel Core2 Quad Mobile Processor Family – 45 nm process technology

    • Quad-core CPU
    • Variants
      • Core 2 Quad Q9100 – 2.26 GHz (2×6 MB L2, 1066 MHz FSB, 45W TDP)
      • Core 2 Quad Q9000 – 2.00 GHz (2×3 MB L2, 1066 MHz FSB, 45W TDP)

Pentium Dual-Core[edit]

  • Allendale – 65 nm process technology

    • Desktop CPU (SMP support restricted to 2 CPUs)
    • Two cores on one die
    • Introduced January 21, 2007
    • SSSE3 SIMD instructions
    • Number of transistors 167 million
    • TXT, enhanced security hardware extensions
    • Execute Disable Bit
    • EIST (Enhanced Intel SpeedStep Technology)
    • Variants
      • Intel Pentium E2240 – 2.40 GHz (1 MB L2, 800 MHz FSB)
      • Intel Pentium E2200 – 2.20 GHz (1 MB L2, 800 MHz FSB)
      • Intel Pentium E2180 – 2.00 GHz (1 MB L2, 800 MHz FSB)
      • Intel Pentium E2160 – 1.80 GHz (1 MB L2, 800 MHz FSB)
      • Intel Pentium E2140 – 1.60 GHz (1 MB L2, 800 MHz FSB)
  • Wolfdale-3M 45 nm process technology
    • Intel Pentium E6800 – 3.33 GHz (2 MB L2,1066 MHz FSB)
    • Intel Pentium E6700 – 3.20 GHz (2 MB L2,1066 MHz FSB)
    • Intel Pentium E6600 – 3.06 GHz (2 MB L2,1066 MHz FSB)
    • Intel Pentium E6500 – 2.93 GHz (2 MB L2,1066 MHz FSB)
    • Intel Pentium E6300 – 2.80 GHz (2 MB L2,1066 MHz FSB)
    • Intel Pentium E5800 – 3.20 GHz (2 MB L2, 800 MHz FSB)
    • Intel Pentium E5700 – 3.00 GHz (2 MB L2, 800 MHz FSB)
    • Intel Pentium E5500 – 2.80 GHz (2 MB L2, 800 MHz FSB)
    • Intel Pentium E5400 – 2.70 GHz (2 MB L2, 800 MHz FSB)
    • Intel Pentium E5300 – 2.60 GHz (2 MB L2, 800 MHz FSB)
    • Intel Pentium E5200 – 2.50 GHz (2 MB L2, 800 MHz FSB)
    • Intel Pentium E2210 – 2.20 GHz (1 MB L2, 800 MHz FSB)

Celeron[edit]

  • Allendale – 65 nm process technology

    • Variants

      • Intel Celeron E1600 – 2.40 GHz (512 KB L2, 800 MHz FSB)
      • Intel Celeron E1500 – 2.20 GHz (512 KB L2, 800 MHz FSB)
      • Intel Celeron E1400 – 2.00 GHz (512 KB L2, 800 MHz FSB)
      • Intel Celeron E1300 – 1.80 GHz (512 KB L2, 800 MHz FSB) (does it exist?)[citation needed]
      • Intel Celeron E1200 – 1.60 GHz (512 KB L2, 800 MHz FSB)
  • Wolfdale-3M – 45 nm process technology
    • Variants

      • Intel Celeron E3500 – 2.70 GHz (1 MB L2, 800 MHz FSB)
      • Intel Celeron E3400 – 2.60 GHz (1 MB L2, 800 MHz FSB)
      • Intel Celeron E3300 – 2.50 GHz (1 MB L2, 800 MHz FSB)
      • Intel Celeron E3200 – 2.40 GHz (1 MB L2, 800 MHz FSB)
  • Conroe-L – 65 nm process technology

    • Variants

      • Intel Celeron 450 – 2.20 GHz (512 KB L2, 800 MHz FSB)
      • Intel Celeron 440 – 2.00 GHz (512 KB L2, 800 MHz FSB)
      • Intel Celeron 430 – 1.80 GHz (512 KB L2, 800 MHz FSB)
      • Intel Celeron 420 – 1.60 GHz (512 KB L2, 800 MHz FSB)
      • Intel Celeron 220 – 1.20 GHz (512 KB L2, 533 MHz FSB)
  • Conroe-CL – 65 nm process technology
    • LGA 771 package
    • Variants
      • Intel Celeron 445 – 1.87 GHz (512 KB L2, 1066 MHz FSB)

Celeron M[edit]

  • Merom-L 65 nm process technology

    • 64 KB L1 cache
    • 1 MB L2 cache (integrated)
    • SSE3 SIMD instructions, 533 MHz front-side bus, execute-disable bit, 64-bit
    • No SpeedStep technology, is not part of the 'Centrino' package
    • Variants
      • 520 – 1.60 GHz
      • 530 – 1.73 GHz
      • 540 – 1.86 GHz
      • 550 – 2.00 GHz
      • 560 – 2.13 GHz

64-bit processors: Intel 64 – Nehalem microarchitecture[edit]

Intel Pentium[edit]

  • Clarkdale – 32 nm process technology

    • 2 physical cores/2 threads
    • 3 MB L3 cache
    • Introduced January 2010
    • Socket 1156 LGA
    • 2-channel DDR3
    • Integrated HD GPU
    • Variants

Core i3[edit]

  • Clarkdale – 32 nm process technology

    • 2 physical cores/4 threads
    • 64 Kb L1 cache
    • 512 Kb L2 cache
    • 4 MB L3 cache
    • Introduced January, 2010
    • Socket 1156 LGA
    • 2-channel DDR3
    • Integrated HD GPU
    • Variants
      • 530 – 2.93 GHz Hyper-Threading
      • 540 – 3.06 GHz Hyper-Threading
      • 550 – 3.2 GHz Hyper-Threading
      • 560 – 3.33 GHz Hyper-Threading

Core i5[edit]

  • Lynnfield – 45 nm process technology

    • 4 physical cores
    • 32+32 Kb (per core) L1 cache
    • 256 Kb (per core) L2 cache
    • 8 MB common L3 cache
    • Introduced September 8, 2009
    • Family 6 Model E (Ext. Model 1E)
    • Socket 1156 LGA
    • 2-channel DDR3
    • Variants
      • 750S – 2.40 GHz/3.20 GHz Turbo Boost
      • 750 – 2.66 GHz/3.20 GHz Turbo Boost
      • 760 – 2.80 GHz/3.33 GHz Turbo Boost
  • Clarkdale – 32 nm process technology

    • 2 physical cores/4 threads
    • 64 Kb L1 cache
    • 512 Kb L2 cache
    • 4 MB L3 cache
    • Introduced January, 2010
    • Socket 1156 LGA
    • 2-channel DDR3
    • Integrated HD GPU
    • AES Support
    • Variants
      • 650/655K – 3.2 GHz Hyper-Threading Turbo Boost
      • 660/661 – 3.33 GHz Hyper-Threading Turbo Boost
      • 670 – 3.46 GHz Hyper-Threading Turbo Boost
      • 680 – 3.60 GHz Hyper-Threading Turbo Boost

Core i7[edit]

  • Bloomfield – 45 nm process technology

    • 4 physical cores
    • 256 KB L2 cache
    • 8 MB L3 cache
    • Front side bus replaced with QuickPath up to 6.4GT/s
    • Hyper-Threading is again included. This had previously been removed at the introduction of Core line
    • 781 million transistors
    • Intel Turbo Boost Technology
    • TDP 130W
    • Introduced November 17, 2008
    • Socket 1366 LGA
    • 3-channel DDR3
    • Variants
      • 975 (extreme edition) – 3.33 GHz/3.60 GHz Turbo Boost
      • 965 (extreme edition) – 3.20 GHz/3.46 GHz Turbo Boost
      • 960 – 3.20 GHz/3.46 GHz Turbo Boost
      • 950 – 3.06 GHz/3.33 GHz Turbo Boost
      • 940 – 2.93 GHz/3.20 GHz Turbo Boost
      • 930 – 2.80 GHz/3.06 GHz Turbo Boost
      • 920 – 2.66 GHz/2.93 GHz Turbo Boost
  • Lynnfield – 45 nm process technology
    • 4 physical cores
    • 256 KB L2 cache
    • 8 MB L3 cache
    • No QuickPath, instead compatible with slower DMI interface
    • Hyper-Threading is included
    • Introduced September 8, 2009
    • Socket 1156 LGA
    • 2-channel DDR3
    • Variants
      • 880 – 3.06 GHz/3.73 GHz Turbo Boost (TDP 95W)
      • 870/875K – 2.93 GHz/3.60 GHz Turbo Boost (TDP 95W)
      • 870S – 2.67 GHz/3.60 GHz Turbo Boost (TDP 82W)
      • 860 – 2.80 GHz/3.46 GHz Turbo Boost (TDP 95W)
      • 860S – 2.53 GHz/3.46 GHz Turbo Boost (TDP 82W)

TODO: Westmere

  • Gulftown – 32 nm process technology

    • 6 physical cores
    • 256 KB L2 cache
    • 12 MB L3 cache
    • Front side bus replaced with QuickPath up to 6.4GT/s
    • Hyper-Threading is included
    • Intel Turbo Boost Technology
    • Socket 1366 LGA
    • TDP 130W
    • Introduced 16 March 2010
    • Variants
      • 990X Extreme Edition – 3.46 GHz/3.73 GHz Turbo Boost
      • 980X Extreme Edition – 3.33 GHz/3.60 GHz Turbo Boost
      • 970 – 3.20 GHz/3.46 GHz Turbo Boost
  • Clarksfield – Intel Core i7 Mobile Processor Family – 45 nm process technology

    • 4 physical cores
    • Hyper-Threading is included
    • Intel Turbo Boost Technology
    • Variants
      • 940XM Extreme Edition – 2.13 GHz/3.33 GHz Turbo Boost (8 MB L3, TDP 55W)
      • 920XM Extreme Edition – 2.00 GHz/3.20 GHz Turbo Boost (8 MB L3, TDP 55W)
      • 840QM – 1.86 GHz/3.20 GHz Turbo Boost (8 MB L3, TDP 45W)
      • 820QM – 1.73 GHz/3.06 GHz Turbo Boost (8 MB L3, TDP 45W)
      • 740QM – 1.73 GHz/2.93 GHz Turbo Boost (6 MB L3, TDP 45W)
      • 720QM – 1.60 GHz/2.80 GHz Turbo Boost (6 MB L3, TDP 45W)

Xeon[edit]

  • Gainestown – 45 nm process technology

    • Same processor dies as Bloomfield
    • 256 KB L2 cache
    • 8 MB L3 cache, 4MB may be disabled
    • QuickPath up to 6.4GT/s
    • Hyper-Threading is included in some models
    • 781 million transistors
    • Introduced March 29, 2009
    • Variants
      • W5590, W5580, X5570, X5560, X5550, E5540, E5530, L5530, E5520, L5520, L5518 – 4 cores, 8 MB L3 cache, HT
      • E5506, L5506, E5504 – 4 cores, 4 MB L3 cache, no HT
      • L5508, E5502, E5502 – 2 cores, 4 MB L3 cache, no HT

64-bit processors: Intel 64 – Sandy Bridge / Ivy Bridge microarchitecture[edit]

This article's factual accuracy may be compromised due to out-of-date information. Please update this article to reflect recent events or newly available information. (June 2013)

Celeron[edit]

  • Sandy Bridge – 32 nm process technology

    • 2 physical cores/2 threads (500 series), 1 physical core/1 thread (model G440) or 1 physical core/2 threads (models G460 & G465)
    • 2 MB L3 cache (500 series), 1 MB (model G440) or 1.5 MB (models G460 & G465)
    • Introduced 3rd quarter, 2011
    • Socket 1155 LGA
    • 2-channel DDR3-1066
    • 400 series has max TDP of 35 W
    • 500-series variants ending in 'T' have a peak TDP of 35 W, others – 65 W
    • Integrated GPU
      • All variants have peak GPU turbo frequencies of 1 GHz
      • Variants in the 400 series have GPUs running at a base frequency of 650 MHz
      • Variants in the 500 series ending in 'T' have GPUs running at a base frequency of 650 MHz; others at 850 MHz
      • All variants have 6 GPU execution units
    • Variants
      • G440 – 1.6 GHz
      • G460 – 1.8 GHz
      • G465 – 1.9 GHz
      • G530T – 2.0 GHz
      • G540T – 2.1 GHz
      • G550T – 2.2 GHz
      • G530 – 2.4 GHz
      • G540 – 2.5 GHz
      • G550 – 2.6 GHz
      • G555 – 2.7 GHz

Pentium[edit]

  • Sandy Bridge – 32 nm process technology

    • 2 physical cores/2 threads
    • 3 MB L3 cache
    • 624 million transistors
    • Introduced May, 2011
    • Socket 1155 LGA
    • 2-channel DDR3-1333 (800 series) or DDR3-1066 (600 series)
    • Variants ending in 'T' have a peak TDP of 35 W, others 65 W
    • Integrated GPU (HD 2000)
      • All variants have peak GPU turbo frequencies of 1.1 GHz
      • Variants ending in 'T' have GPUs running at a base frequency of 650 MHz; others at 850 MHz
      • All variants have 6 GPU execution units
    • Variants
      • G620T – 2.2 GHz
      • G630T – 2.3 GHz
      • G640T – 2.4 GHz
      • G645T – 2.5 GHz
      • G860T – 2.6 GHz
      • G620 – 2.6 GHz
      • G622 – 2.6 GHz
      • G630 – 2.7 GHz
      • G632 – 2.7 GHz
      • G640 – 2.8 GHz
      • G840 – 2.8 GHz
      • G645 – 2.9 GHz
      • G850 – 2.9 GHz
      • G860 – 3.0 GHz
      • G870 – 3.1 GHz
  • Ivy Bridge – 22 nm Tri-gate transistor process technology

    • 2 physical cores/2 threads
    • 32+32 Kb (per core) L1 cache
    • 256 Kb (per core) L2 cache
    • 3 MB L3 cache
    • Introduced September, 2012
    • Socket 1155 LGA
    • 2-channel DDR3-1333 for G2000 series
    • 2-channel DDR3-1600 for G2100 series
    • All variants have GPU base frequencies of 650 MHz and peak GPU turbo frequencies of 1.05 GHz
    • Variants ending in 'T' have a peak TDP of 35 W, others – TDP of 55 W
    • Variants
      • G2020T – 2.5 GHz
      • G2030T – 2.6 GHz
      • G2100T – 2.6 GHz
      • G2120T – 2.7 GHz
      • G2020 – 2.9 GHz
      • G2030 – 3.0 GHz
      • G2120 – 3.1 GHz
      • G2130 – 3.2 GHz
      • G2140 – 3.3 GHz

Core i3[edit]

  • Sandy Bridge – 32 nm process technology

    • 2 physical cores/4 threads
    • 32+32 Kb (per core) L1 cache
    • 256 Kb (per core) L2 cache
    • 3 MB L3 cache
    • 624 million transistors
    • Introduced January, 2011
    • Socket 1155 LGA
    • 2-channel DDR3-1333
    • Variants ending in 'T' have a peak TDP of 35 W, others 65 W
    • Integrated GPU
      • All variants have peak GPU turbo frequencies of 1.1 GHz
      • Variants ending in 'T' have GPUs running at a base frequency of 650 MHz; others at 850 MHz
      • Variants ending in '5' have Intel HD Graphics 3000 (12 execution units); others have Intel HD Graphics 2000 (6 execution units)
    • Variants
      • i3-2100T – 2.5 GHz
      • i3-2120T – 2.6 GHz
      • i3-2100 – 3.1 GHz
      • i3-2102 – 3.1 GHz
      • i3-2105 – 3.1 GHz
      • i3-2120 – 3.3 GHz
      • i3-2125 – 3.3 GHz
      • i3-2130 – 3.4 GHz
  • Ivy Bridge – 22 nm Tri-gate transistor process technology

    • 2 physical cores/4 threads
    • 32+32 Kb (per core) L1 cache
    • 256 Kb (per core) L2 cache
    • 3 MB L3 cache
    • Introduced September, 2012
    • Socket 1155 LGA
    • 2-channel DDR3-1600
    • Variants ending in '5' have Intel HD Graphics 4000; others have Intel HD Graphics 2500
    • All variants have GPU base frequencies of 650 MHz and peak GPU turbo frequencies of 1.05 GHz
    • TDP 55 W
    • Variants
      • i3-3220T – 2.8 GHz
      • i3-3240T – 2.9 GHz
      • i3-3220 – 3.3 GHz
      • i3-3225 – 3.3 GHz
      • i3-3240 – 3.4 GHz

Core i5[edit]

  • Sandy Bridge – 32 nm process technology

    • 4 physical cores/4 threads (except for i5-2390T which has 2 physical cores/4 threads)
    • 32+32 Kb (per core) L1 cache
    • 256 Kb (per core) L2 cache
    • 6 MB L3 cache (except for i5-2390T which has 3 MB)
    • 995 million transistors
    • Introduced January, 2011
    • Socket 1155 LGA
    • 2-channel DDR3-1333
    • Variants ending in 'S' have a peak TDP of 65 W, others – 95 W except where noted
    • Variants ending in 'K' have unlocked multipliers; others cannot be overclocked
    • Integrated GPU
      • i5-2500T has a peak GPU turbo frequency of 1.25 GHz, others 1.1 GHz
      • Variants ending in 'T' have GPUs running at a base frequency of 650 MHz; others at 850 MHz
      • Variants ending in '5' or 'K' have Intel HD Graphics 3000 (12 execution units), except i5-2550K which has no GPU; others have Intel HD Graphics 2000 (6 execution units)
      • Variants ending in 'P' and the i5-2550K have no GPU
    • Variants
      • i5-2390T – 2.7 GHz/3.5 GHz Turbo Boost (35 W max TDP)
      • i5-2500T – 2.3 GHz/3.3 GHz Turbo Boost (45 W max TDP)
      • i5-2400S – 2.5 GHz/3.3 GHz Turbo Boost
      • i5-2405S – 2.5 GHz/3.3 GHz Turbo Boost
      • i5-2500S – 2.7 GHz/3.7 GHz Turbo Boost
      • i5-2300 – 2.8 GHz/3.1 GHz Turbo Boost
      • i5-2310 – 2.9 GHz/3.2 GHz Turbo Boost
      • i5-2320 – 3.0 GHz/3.3 GHz Turbo Boost
      • i5-2380P – 3.1 GHz/3.4 GHz Turbo Boost
      • i5-2400 – 3.1 GHz/3.4 GHz Turbo Boost
      • i5-2450P – 3.2 GHz/3.5 GHz Turbo Boost
      • i5-2500 – 3.3 GHz/3.7 GHz Turbo Boost
      • i5-2500K – 3.3 GHz/3.7 GHz Turbo Boost
      • i5-2550K – 3.4 GHz/3.8 GHz Turbo Boost
  • Ivy Bridge – 22 nm Tri-gate transistor process technology

    • 4 physical cores/4 threads (except for i5-3470T which has 2 physical cores/4 threads)
    • 32+32 Kb (per core) L1 cache
    • 256 Kb (per core) L2 cache
    • 6 MB L3 cache (except for i5-3470T which has 3 MB)
    • Introduced April, 2012
    • Socket 1155 LGA
    • 2-channel DDR3-1600
    • Variants ending in 'S' have a peak TDP of 65 W, Variants ending in 'T' have a peak TDP of 35 or 45 W (see variants), others – 77 W except where noted
    • Variants ending in 'K' have unlocked multipliers; others cannot be overclocked
    • Variants ending in 'P' have no integrated GPU; others have Intel HD Graphics 2500 or Intel HD Graphics 4000 (i5-3475S and i5-3570K only)
    • Variants
      • i5-3470T – 2.9 GHz/3.6 GHz max Turbo Boost (35 W TDP)
      • i5-3570T – 2.3 GHz/3.3 GHz max Turbo Boost (45 W TDP)
      • i5-3330S – 2.7 GHz/3.2 GHz max Turbo Boost
      • i5-3450S – 2.8 GHz/3.5 GHz max Turbo Boost
      • i5-3470S – 2.9 GHz/3.6 GHz max Turbo Boost
      • i5-3475S – 2.9 GHz/3.6 GHz max Turbo Boost
      • i5-3550S – 3.0 GHz/3.7 GHz max Turbo Boost
      • i5-3570S – 3.1 GHz/3.8 GHz max Turbo Boost
      • i5-3330 – 3.0 GHz/3.2 GHz max Turbo Boost
      • i5-3350P – 3.1 GHz/3.3 GHz max Turbo Boost (69 W TDP)
      • i5-3450 – 3.1 GHz/3.5 GHz max Turbo Boost
      • i5-3470 – 3.2 GHz/3.6 GHz max Turbo Boost
      • i5-3550 – 3.3 GHz/3.7 GHz max Turbo Boost
      • i5-3570 – 3.4 GHz/3.8 GHz max Turbo Boost
      • i5-3570K – 3.4 GHz/3.8 GHz max Turbo Boost

Core i7[edit]

  • Sandy Bridge – 32 nm process technology

    • 4 physical cores/8 threads
    • 32+32 Kb (per core) L1 cache
    • 256 Kb (per core) L2 cache
    • 8 MB L3 cache
    • 995 million transistors
    • Introduced January, 2011
    • Socket 1155 LGA
    • 2-channel DDR3-1333
    • Variants ending in 'S' have a peak TDP of 65 W, others – 95 W
    • Variants ending in 'K' have unlocked multipliers; others cannot be overclocked
    • Integrated GPU
      • All variants have base GPU frequencies of 850 MHz and peak GPU turbo frequencies of 1.35 GHz
      • Variants ending in 'K' have Intel HD Graphics 3000 (12 execution units); others have Intel HD Graphics 2000 (6 execution units)
    • Variants
      • i7-2600S – 2.8 GHz/3.8 GHz Turbo Boost
      • i7-2600 – 3.4 GHz/3.8 GHz Turbo Boost
      • i7-2600K – 3.4 GHz/3.8 GHz Turbo Boost
      • i7-2700K – 3.5 GHz/3.9 GHz Turbo Boost
  • Sandy Bridge-E – 32 nm process technology

    • Up to 8 physical cores/16 threads depending on model number
    • 32+32 Kb (per core) L1 cache
    • 256 Kb (per core) L2 cache
    • Up to 20 MB L3 cache depending on model number
    • 2270 million transistors
    • Introduced November, 2011
    • Socket 2011 LGA
    • 4-channel DDR3-1600
    • All variants have a peak TDP of 130 W
    • No integrated GPU
    • Variants
      • i7-3820 – 3.6 GHz/3.8 GHz Turbo Boost, 4 cores, 10 MB L3 cache
      • i7-3930K – 3.2 GHz/3.8 GHz Turbo Boost, 6 cores, 12 MB L3 cache
      • i7-3960X – 3.3 GHz/3.9 GHz Turbo Boost, 6 cores, 15 MB L3 cache
      • i7-3970X – 3.5 GHz/4.0 GHz Turbo Boost, 6 cores, 15 MB L3 cache
  • Ivy Bridge – 22 nm Tri-gate transistor process technology

    • 4 physical cores/8 threads
    • 32+32 Kb (per core) L1 cache
    • 256 Kb (per core) L2 cache
    • 8 MB L3 cache
    • Introduced April, 2012
    • Socket 1155 LGA
    • 2-channel DDR3-1600
    • Variants ending in 'S' have a peak TDP of 65 W, variants ending in 'T' have a peak TDP of 45 W, others – 77 W
    • Variants ending in 'K' have unlocked multipliers; others cannot be overclocked
    • Integrated GPU Intel HD Graphics 4000
    • Variants
      • i7-3770T – 2.5 GHz/3.7 GHz Turbo Boost
      • i7-3770S – 3.1 GHz/3.9 GHz Turbo Boost
      • i7-3770 – 3.4 GHz/3.9 GHz Turbo Boost
      • i7-3770K – 3.5 GHz/3.9 GHz Turbo Boost

64-bit processors: Intel 64 – Haswell microarchitecture[edit]

See also[edit]

References[edit]

  1. Jump up^ The 4004's original goal was to equal the clock rate of the IBM 1620 Model I (1 MHz); this was not quite met.
  2. Jump up^ http://www.depi.itch.edu.mx/apacheco/asm/Intel_cpus.htm
  3. Jump up to:a b c "Intel Microprocessor Quick Reference Guide – Product Family". Retrieved 2010-01-08.
  4. Jump up to:a b c Intel IAPX 86,88 User's Manual, August 1981, Intel order number 210201-001
  5. Jump up^ Intel Processor Spec Finder for Celeron M Archived 22 January 2011 at WebCite
  6. Jump up^ Not listed as an official model by Intel but used by Apple in their Intel-based Mac Mini, released March 2006[dead link]
  7. Jump up^ "Intel Pentium Processor G6950 (3M Cache, 2.80 GHz) with SPEC Code(s) SLBMS". Ark.intel.com. 2010-07-13. Archivedfrom the original on 2011-01-22. Retrieved 2010-07-29.

External links[edit]

http://en.wikipedia.org/wiki/Intel_Tick-Tock

Intel Tick-Tock

From Wikipedia, the free encyclopedia
 
 
It has been suggested that this article be merged with List of Intel CPU microarchitectures. (DiscussProposed since March 2013.

"Tick-Tock" is a model adopted by chip manufacturer Intel Corporation since 2007 to follow every microarchitectural change with a die shrink of the process technology. Every "tick" is a shrinking of process technology of the previous microarchitecture (and sometimes introducing new instructions as with Broadwell) and every "tock" is a new microarchitecture.[1] Every year to 18 months, there is expected to be one tick or tock.[1]

Roadmap[edit]

Architectural change Fabrication process Microarchitecture Codenames Release date Processors
8P/4P Server 4P/2P Server/WS Enthusiast/WS Desktop Mobile Marketing names
Tick Die shrink 65 nm P6NetBurst PreslerCedar Mill,Yonah January 5, 2006     Presler Cedar Mill Yonah
Tock New microarchitecture Core Merom[2] July 27, 2006[3] Tigerton Woodcrest
Clovertown
Kentsfield Conroe Merom
Tick Die shrink 45 nm Penryn November 11, 2007[4] Dunnington Harpertown Yorkfield Wolfdale Penryn
Tock New microarchitecture Nehalem Nehalem November 17, 2008[5] Beckton Gainestown Bloomfield Lynnfield Clarksfield
Tick Die shrink 32 nm Westmere January 4, 2010[6][7] Westmere-EX Westmere-EP Gulftown Clarkdale Arrandale
Tock New microarchitecture Sandy Bridge Sandy Bridge January 9, 2011[8] (Skipped)[9] Sandy Bridge-EP Sandy Bridge-E Sandy Bridge Sandy Bridge-M
Tick Die shrink 22 nm Ivy Bridge April 29, 2012 Ivy Bridge-EX[10] Ivy Bridge-EP[10] Ivy Bridge-E[11] Ivy Bridge Ivy Bridge-M
Tock New microarchitecture Haswell Haswell June 2, 2013       Haswell-DT[12]
  • Haswell-MB (notebooks)
  • Haswell-LP (ultrabooks)[12]
Tick Die shrink 14 nm[13] Broadwell[14] 2014[6]            
Tock New microarchitecture Skylake[14] Skylake[14] 2015            
Tick Die shrink 10 nm[15] Cannonlake 2016            
Tock New microarchitecture     2017            
Tick Die shrink 7 nm[15]   2018            
Tock New microarchitecture     2019            
Tick Die shrink 5 nm[15]   2020            
Tock New microarchitecture     2021            
[hide]Extended content
Atom Roadmap[16]
  Fabrication process Microarchitecture Release date Processors/SoCs
MID, Smartphone Tablet Nettop, netbook Embedded Server CE
  45 nm Bonnell 2008 Silverthorne N/A Diamondville Tunnel Creek N/A Sodaville
2010 Lincroft Pineview Groveland
32 nm 2011 Penwell Cedarview  ? Centerton Berryville
2012 Cloverview
22 nm Silvermont 2013 Tangier[17] Valleyview Unknown Rangeley Avoton Unknown
Tick 14 nm[16] 2014 Anniedale[citation needed] Cherryview[citation needed] Unknown Unknown Denverton Unknown
Tock Goldmont[18][19] 2015 Broxton[20] Unknown Unknown Unknown Unknown
Intel CPU core roadmaps from NetBurst and P6 to Cannonlake
 
NetBurst
Willamette Northwood Prescott Tejas Nehalem
  Cedarmill
  Prescott-2M Cedar Mill
  Smithfield Presler
P6 Core Nehalem Sandy Bridge Haswell Skylake
Coppermine Tualatin Banias Dothan Yonah Core Penryn Nehalem Westmere Sandy Bridge Ivy Bridge Haswell Broadwell Skylake Cannonlake
180 nm 130 nm 90 nm 65 nm 45 nm 32 nm 22 nm 14 nm 10 nm
  Bonnell Silvermont Goldmont
  Bonnell Saltwell Silvermont Airmont Goldmont
 

http://www.intel.com/content/www/us/en/silicon-innovations/intel-tick-tock-model-general.html

The Tick-Tock Model Through the Years

Intel’s “tick-tock” model inspires confidence in the future of microprocessors and the devices that depend on them. Following this model, Intel commits to—and has successfully delivered—continued innovations in manufacturing process technology and processor microarchitecture in alternating “tick” and “tock” cycles.

A tick advances manufacturing technology

With a “tick” cycle every couple of years, look for Intel to advance manufacturing process technology and continue to deliver the expected benefits of Moore’s Law to users. The typical increase in transistor density enables new capabilities, higher performance levels, and greater energy efficiency—all within a smaller, more capable version of the previous “tock” microarchitecture.

For example, a “tick” coincided with the Intel introduction of 3D tri-gate transistors with the 22nm manufacturing process technology. This new technology delivers better performance and extends the battery life of smartphones, tablets, and the new, incredibly slim Ultrabook™ devices.

A tock delivers new microarchitecture

In alternating “tock” cycles, expect Intel to use the previous “tick” cycle’s manufacturing process technologies to introduce the next big innovation in processor microarchitecture. Intel® microarchitecture advancements seek to improve energy efficiency and performance as well as functionality and density of features such as hardware-supported video transcoding, encryption/decryption, and other integrated capabilities.

Sustained microprocessor leadership

In the last "tock," Intel vastly improved mainstream gaming, HD video, Web, and other user experiences with the Intel® microarchitecture code name Sandy Bridge, manufactured with the 32nm process technology.

The following "tick" introduced the embedded 3rd generation Intel® Core™ i7 processor with mobile Intel® HM76/QM77 Express Chipsets, which is a low-power platform that provides remote manageability/security, ECC memory, and power-saving functions ideal for mobile intelligent applications.

Predictable processor advancements

Intel design teams work in parallel around the globe to deliver coordinated technology advances inspired by the tick-tock model. A yearly product cadence moves the industry forward in a predictable fashion that can be planned in advance.

22nm 3-D transistors: Offering unprecedented performance and efficiency >

Investing in the industry

Thousands of vendors depend on Intel® processors for product development. To help them forge ahead with new product advancements, Intel invests heavily in research that drives innovations at the silicon level and establishes new, industry-wide standards. Combined with the predictability of Intel’s tick-tock model, these efforts promote faster, more efficient innovation throughout the industry—year-in and year-out.

 

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