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http://en.wikipedia.org/wiki/Surface-mount_technology Surface-mount technology (SMT) is a method for producing electronic circuits in which the components are mounted or placed directly onto the surface of printed circuit boards (PCBs). An electronic…

Programmed Adjustable Power I just explored an easy scheme to design a high precision programmed adjustable power.In this scheme, there is no needs to make a complex PWM circult, just a liner or switcher adjustable voltage regulator and a resister ne…

(注:Unity 2018.1及以后的版本才可以使用Package Manager.) 一个package是一个容器,里面放的是Assets, Shaders, Textures, plug-ins, icons 和c# scripts,可以用来增强你项目的各个部分.Unity packages是Asset Store packages的更新(newer).更紧密集成的版本(more tightly integrated versions),能够为Unity提供更广泛的增强功能. 使用Unity…

Sound card based RFID sniffer/emulator (Too tired after recon.cx to do draw the schematics better than that :) Stay tuned for the next version including Tag emulation.) baudline FFT signal analyzer for sniffing LF RFID tags using our sound card based…

This 125 kHz RFID reader http://www.serasidis.gr/circuits/RFID_reader/125kHz_RFID_reader.htm http://www.serasidis.gr/circuits/RFID_reader/images/125kHz_RFID_reader_schem.GIF I will try to explain with simple words how the RFID works. The ATtiny13 use…

Introduction The attached files provide a port of a combined TBLCF/DSC code to a MC9S08JS16 processor. The primary motivation for this was to produce a single BDM that could be used with a range of Freescale microcontrollers. Other features have also…

Introduction The attached files provide a port of a combined TBDML/OSBDM/TBLCF code to a MC9S08JM16/32/60 processor. The primary motivation for this was to produce a single BDM that could be used with a range of Freescale microcontrollers. Other feat…

总结Allegro元件封装(焊盘)制作方法 在Allegro系统中,建立一个零件(Symbol)之前,必须先建立零件的管脚(Pin).元件封装大体上分两种,表贴和直插.针对不同的封装,需要制作不同的Padstack. Allegro中Padstack主要包括以下部分.1.PAD即元件的物理焊盘    pad有三种: Regular Pad,规则焊盘(正片中).可以是:Circle 圆型.Square 方型.Oblong 拉长圆型.Rectangle 矩型.Octagon 八边型.Shape形状(…

1.BGA(ball grid array)球形触点陈列,表面贴装型封装之一.在印刷基板的背面按陈列方式制作出球形凸点用 以 代替引脚,在印刷基板的正面装配LSI 芯片,然后用模压树脂或灌封方法进行密封.也 称为凸 点陈列载体(PAC).引脚可超过200,是多引脚LSI 用的一种封装. 封装本体也可做得比QFP(四侧引脚扁平封装)小.例如,引脚中心距为1.5mm 的360 引脚 BGA 仅为31mm 见方:而引脚中心距为0.5mm 的304 引脚QFP 为40mm 见方.而且BGA 不 用担心Q…